Yuji SAWADA

Person

  • Iwate, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Deposition method and deposition apparatus

    • Patent number 12,368,030
    • Issue date Jul 22, 2025
    • Tokyo Electron Limited
    • Hitoshi Kato
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plasma processing apparatus

    • Patent number 12,051,566
    • Issue date Jul 30, 2024
    • Tokyo Electron Limited
    • Hitoshi Kato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Deposition method

    • Patent number 11,328,901
    • Issue date May 10, 2022
    • Tokyo Electron Limited
    • Shigehiro Miura
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    DEPOSITION METHOD AND DEPOSITION APPARATUS

    • Publication number 20230230817
    • Publication date Jul 20, 2023
    • TOKYO ELECTRON LIMITED
    • Hitoshi KATO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PLASMA PROCESSING APPARATUS

    • Publication number 20220230852
    • Publication date Jul 21, 2022
    • TOKYO ELECTRON LIMITED
    • Hitoshi KATO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEPOSITION METHOD

    • Publication number 20200312621
    • Publication date Oct 1, 2020
    • TOKYO ELECTRON LIMITED
    • Shigehiro MIURA
    • H01 - BASIC ELECTRIC ELEMENTS