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Yuji SHIKASHO
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Power semiconductor device and manufacturing method thereof
Patent number
11,735,509
Issue date
Aug 22, 2023
Mitsubishi Electric Corporation
Keitaro Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer-mold type power module and lead frame
Patent number
11,335,629
Issue date
May 17, 2022
Mitsubishi Electric Corporation
Fumihito Kawahara
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
POWER SEMICONDUCTOR DEVICE
Publication number
20240234260
Publication date
Jul 11, 2024
Mitsubishi Electric Corporation
Takuya SAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE
Publication number
20240136257
Publication date
Apr 25, 2024
Mitsubishi Electric Corporation
Takuya SAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230335480
Publication date
Oct 19, 2023
Mitsubishi Electric Corporation
Keitaro ICHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230238311
Publication date
Jul 27, 2023
Mitsubishi Electric Corporation
Keitaro ICHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSFER-MOLD TYPE POWER MODULE AND LEAD FRAME
Publication number
20210249341
Publication date
Aug 12, 2021
Mitsubishi Electric Corporation
Fumihito KAWAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20200303295
Publication date
Sep 24, 2020
Mitsubishi Electric Corporation
Keitaro ICHIKAWA
H01 - BASIC ELECTRIC ELEMENTS