Yuji Shirai

Person

Fuchu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting component
- Patent number 11,929,589
- Issue date Mar 12, 2024
- FUJIFILM Business Innovation Corp.
- Takashi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic components and method of manufacturing the same
- Patent number 9,001,528
- Issue date Apr 7, 2015
- Renesas Electronics Corporation
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,763,242
- Issue date Jul 1, 2014
- Renesas Electronics Corporation
- Kenya Kawano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,742,499
- Issue date Jun 3, 2014
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,656,030
- Issue date Feb 2, 2010
- Renesas Technology Corp.
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave filter and manufacturing method of the same
- Patent number 7,583,163
- Issue date Sep 1, 2009
- Renesas Technology Corp.
- Yasuo Osone
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device
- Patent number 7,554,193
- Issue date Jun 30, 2009
- Renesas Technology Corp.
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of that
- Patent number 6,946,327
- Issue date Sep 20, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device and its manufacturing method
- Patent number 6,867,123
- Issue date Mar 15, 2005
- Renesas Technology Corp.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip size package having rerouting layers
- Patent number 6,861,742
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 6,841,881
- Issue date Jan 11, 2005
- Renesas Technology Corp.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 6,828,174
- Issue date Dec 7, 2004
- Renesas Technology Corp.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a molded semiconductor device having blocking...
- Patent number 5,525,547
- Issue date Jun 11, 1996
- Hitachi, Ltd.
- Toshihiro Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 5,402,318
- Issue date Mar 28, 1995
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI package cooling heat sink, method of manufacturing the same and...
- Patent number 5,358,032
- Issue date Oct 25, 1994
- Hitachi, Ltd.
- Masatsugu Arai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor apparatus of module installing type
- Patent number 5,315,482
- Issue date May 24, 1994
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI cooling apparatus and computer cooling apparatus
- Patent number 5,195,576
- Issue date Mar 23, 1993
- Hitachi, Ltd.
- Toshio Hatada
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Wire bonding apparatus
- Patent number 4,527,730
- Issue date Jul 9, 1985
- Hitachi, Ltd.
- Yuji Shirai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING COMPONENT
- Publication number 20210305771
- Publication date Sep 30, 2021
- FUJIFILM Business Innovation Corp.
- Takashi KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120292772
- Publication date Nov 22, 2012
- Renesas Electronics Corporation
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110248389
- Publication date Oct 13, 2011
- RENESAS ELECTRONICS CORPORATION
- Chiko YORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110156225
- Publication date Jun 30, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Hozoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110128713
- Publication date Jun 2, 2011
- RENESAS ELECTRONICS CORPORATION
- Kenya KAWANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100230789
- Publication date Sep 16, 2010
- RENESAS TECHNOLOGY CORP.
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100172116
- Publication date Jul 8, 2010
- RENESAS TECHNOLOGY CORP.
- Chiko Yorita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100109052
- Publication date May 6, 2010
- RENESAS TECHNOLOGY CORP.
- Shizuki NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Acoustic wave filter and manufacturing method of the same
- Publication number 20080129412
- Publication date Jun 5, 2008
- Renesas Technology Corp.
- Yasuo Osone
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor device
- Publication number 20070176298
- Publication date Aug 2, 2007
- Hitachi, Ltd
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070040255
- Publication date Feb 22, 2007
- Yasuo Osone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of that
- Publication number 20040155351
- Publication date Aug 12, 2004
- RENESAS TECHNOLOGY CORPORATION
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and its manufacturing method
- Publication number 20040023450
- Publication date Feb 5, 2004
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20030111737
- Publication date Jun 19, 2003
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20020185744
- Publication date Dec 12, 2002
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of that
- Publication number 20020093082
- Publication date Jul 18, 2002
- Toshio Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Yuji Shirai

Person

Patents Grantslast 30 patents

Light-emitting component

Shielded electronic components and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device

Acoustic wave filter and manufacturing method of the same

Semiconductor device

Semiconductor device and manufacturing method of that

Semiconductor integrated circuit device and its manufacturing method

Wafer level chip size package having rerouting layers

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Method of fabricating a molded semiconductor device having blocking...

Semiconductor integrated circuit device

LSI package cooling heat sink, method of manufacturing the same and...

Semiconductor apparatus of module installing type

LSI cooling apparatus and computer cooling apparatus

Wire bonding apparatus

Patents Applicationslast 30 patents

LIGHT-EMITTING COMPONENT

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Acoustic wave filter and manufacturing method of the same

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method of that

Semiconductor integrated circuit device and its manufacturing method

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method of that