YUJI TAKAOKA

Person

KANAGAWA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Imaging device for connection with a circuit element
- Patent number 11,800,249
- Issue date Oct 24, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,977
- Issue date Jun 13, 2023
- Sony Group Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, production method, and electronic device
- Patent number 11,356,584
- Issue date Jun 7, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,315,970
- Issue date Apr 26, 2022
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device for connection with a circuit element
- Patent number 11,245,863
- Issue date Feb 8, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with flexible printed circuits
- Patent number 11,171,170
- Issue date Nov 9, 2021
- Sony Corporation
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with a gap control electrode and method of man...
- Patent number 10,867,950
- Issue date Dec 15, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element package and camera module having a slit formed in a...
- Patent number 10,720,459
- Issue date Jul 21, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,720,402
- Issue date Jul 21, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,050,074
- Issue date Aug 14, 2018
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with less positional deviation between apertur...
- Patent number 10,014,248
- Issue date Jul 3, 2018
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,379,155
- Issue date Jun 28, 2016
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,041,179
- Issue date May 26, 2015
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having a through-hole interconnection
- Patent number 8,564,101
- Issue date Oct 22, 2013
- Sony Corporation
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor apparatus having a through...
- Patent number 8,273,657
- Issue date Sep 25, 2012
- Sony Corporation
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,252,628
- Issue date Aug 28, 2012
- Sony Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device
- Patent number 7,851,880
- Issue date Dec 14, 2010
- Sony Corporation
- Masami Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 7,402,901
- Issue date Jul 22, 2008
- Sony Corporation
- Masaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a semiconductor device having a plurality o...
- Patent number 7,135,378
- Issue date Nov 14, 2006
- Sony Corporation
- Yuji Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method of manufacturing same
- Patent number 7,064,005
- Issue date Jun 20, 2006
- Sony Corporation
- Yuji Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-like electronic components, a method of manufacturing the same...
- Patent number 6,936,525
- Issue date Aug 30, 2005
- Sony Corporation
- Kazuo Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching aluminum metal films
- Patent number 5,827,436
- Issue date Oct 27, 1998
- Sony Corporation
- Yukihiro Kamide
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220231061
- Publication date Jul 21, 2022
- SONY GROUP CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20220132059
- Publication date Apr 28, 2022
- Sony Semiconductor Solutions Corporation
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE, PRODUCTION METHOD, AND ELECTRONIC DEVICE
- Publication number 20210281721
- Publication date Sep 9, 2021
- Sony Semiconductor Solutions Corporation
- YUTA MOMIUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGING DEVICE
- Publication number 20210250534
- Publication date Aug 12, 2021
- Sony Semiconductor Solutions Corporation
- YUTA MOMIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE AND CAMERA MODULE
- Publication number 20190267418
- Publication date Aug 29, 2019
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- YUTA MOMIUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190043905
- Publication date Feb 7, 2019
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SAME, AND ELECTRONIC...
- Publication number 20180204870
- Publication date Jul 19, 2018
- SONY CORPORATION
- YUTA MOMIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170162493
- Publication date Jun 8, 2017
- SONY CORPORATION
- MAKOTO MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170148760
- Publication date May 25, 2017
- SONY CORPORATION
- MAKOTO MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170141064
- Publication date May 18, 2017
- SONY CORPORATION
- MAKOTO MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170141065
- Publication date May 18, 2017
- SONY CORPORATION
- MAKOTO MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160276385
- Publication date Sep 22, 2016
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150221690
- Publication date Aug 6, 2015
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140183680
- Publication date Jul 3, 2014
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120286387
- Publication date Nov 15, 2012
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110136342
- Publication date Jun 9, 2011
- SONY CORPORATION
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090200679
- Publication date Aug 13, 2009
- SONY CORPORATION
- Yoshimichi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUAFCTURING THE SAME
- Publication number 20080224249
- Publication date Sep 18, 2008
- SONY CORPORATION
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080138932
- Publication date Jun 12, 2008
- SONY CORPORATION
- Masaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20080128848
- Publication date Jun 5, 2008
- SONY CORPORATION
- Masami Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20060226527
- Publication date Oct 12, 2006
- Masaki Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabricating the same
- Publication number 20040113245
- Publication date Jun 17, 2004
- Yuji Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20040115919
- Publication date Jun 17, 2004
- Yuji Takaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-like electronic components, a method of manufacturing the same...
- Publication number 20030092252
- Publication date May 15, 2003
- Kazuo Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-like electronic components, a method of manufacturing the same...
- Publication number 20020011655
- Publication date Jan 31, 2002
- Kazuo Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabricating the same
- Publication number 20020004257
- Publication date Jan 10, 2002
- Yuji Takaoka
- H01 - BASIC ELECTRIC ELEMENTS

YUJI TAKAOKA

Person

Patents Grantslast 30 patents

Imaging device for connection with a circuit element

Semiconductor device

Camera module, production method, and electronic device

Semiconductor device and method of manufacturing the same

Imaging device for connection with a circuit element

Image sensor package with flexible printed circuits

Semiconductor device with a gap control electrode and method of man...

Imaging element package and camera module having a slit formed in a...

Semiconductor device and method of manufacturing the same

Semiconductor chip mounted on a packaging substrate

Semiconductor device and method of manufacturing the same

Semiconductor device with less positional deviation between apertur...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor apparatus having a through-hole interconnection

Method for manufacturing a semiconductor apparatus having a through...

Semiconductor device and method of manufacturing the same

Solid-state imaging device

Semiconductor device and method of manufacturing semiconductor device

Process for fabricating a semiconductor device having a plurality o...

Semiconductor apparatus and method of manufacturing same

Chip-like electronic components, a method of manufacturing the same...

Method for etching aluminum metal films

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGING DEVICE

CAMERA MODULE, PRODUCTION METHOD, AND ELECTRONIC DEVICE

IMAGING DEVICE

IMAGING ELEMENT PACKAGE AND CAMERA MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SAME, AND ELECTRONIC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUAFCTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SOLID-STATE IMAGING DEVICE

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and process for fabricating the same

Semiconductor device and its manufacturing method

Chip-like electronic components, a method of manufacturing the same...

Chip-like electronic components, a method of manufacturing the same...

Semiconductor device and process for fabricating the same