Yuji TOSAKA

Person

Chikusei-shi, Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-clad laminate, printed wiring board and semiconductor package
- Patent number 11,497,117
- Issue date Nov 8, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board and semiconductor package
- Patent number 11,040,517
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Takeshi Saitoh
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing FRP precursor and device for producing same
- Patent number 10,933,562
- Issue date Mar 2, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg, printed circuit board, semiconductor package, and method f...
- Patent number 10,856,423
- Issue date Dec 1, 2020
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRIN...
- Publication number 20240247120
- Publication date Jul 25, 2024
- Shunsuke TONOUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING FRP PRECURSOR
- Publication number 20230323108
- Publication date Oct 12, 2023
- Yuji TOSAKA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200323078
- Publication date Oct 8, 2020
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20190315094
- Publication date Oct 17, 2019
- Hitachi Chemical Company, Ltd.
- Takeshi SAITOH
- B32 - LAYERED PRODUCTS
Information Patent Application
FRP PRECURSOR, LAMINATED PLATE, METAL-CLAD LAMINATE, PRINTED CIRCUI...
- Publication number 20190037691
- Publication date Jan 31, 2019
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20190021175
- Publication date Jan 17, 2019
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING FRP PRECURSOR AND DEVICE FOR PRODUCING SAME
- Publication number 20180345539
- Publication date Dec 6, 2018
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR PRODUCING FRP PRECURSOR AND DEVICE FOR PRODUCING SAME
- Publication number 20180345540
- Publication date Dec 6, 2018
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Yuji TOSAKA

Person

Patents Grantslast 30 patents

Metal-clad laminate, printed wiring board and semiconductor package

Printed wiring board and semiconductor package

Method for producing FRP precursor and device for producing same

Prepreg, printed circuit board, semiconductor package, and method f...

Patents Applicationslast 30 patents

PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRIN...

METHOD FOR PRODUCING FRP PRECURSOR

METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

FRP PRECURSOR, LAMINATED PLATE, METAL-CLAD LAMINATE, PRINTED CIRCUI...

PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...

METHOD FOR PRODUCING FRP PRECURSOR AND DEVICE FOR PRODUCING SAME

METHOD FOR PRODUCING FRP PRECURSOR AND DEVICE FOR PRODUCING SAME