Yuji Tsukamoto

Person

Wilmington, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature controlled substrate holder having erosion resistant in...
- Patent number 8,450,657
- Issue date May 28, 2013
- Tokyo Electron Limited
- Yuji Tsukamoto
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Temperature controlled substrate holder with non-uniform insulation...
- Patent number 8,207,476
- Issue date Jun 26, 2012
- Tokyo Electron Limited
- Yuji Tsukamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post-etch treatment system for removing residue on a substrate
- Patent number 8,057,633
- Issue date Nov 15, 2011
- Tokyo Electron Limited
- Yuji Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas distribution system for a post-etch treatment system
- Patent number 8,034,176
- Issue date Oct 11, 2011
- Tokyo Electron Limited
- Yuji Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for multi-step temperature control of a substrate
- Patent number 7,952,049
- Issue date May 31, 2011
- Tokyo Electron Limited
- Yuji Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled substrate holder having erosion resistant in...
- Patent number 7,838,800
- Issue date Nov 23, 2010
- Tokyo Electron Limited
- Yuji Tsukamoto
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
Temperature controlled substrate holder with non-uniform insulation...
- Patent number 7,723,648
- Issue date May 25, 2010
- Tokyo Electron Limited
- Yuji Tsukamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for multi-step temperature control of a substrate
- Patent number 7,297,894
- Issue date Nov 20, 2007
- Tokyo Electron Limited
- Yuji Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for temperature control of a substrate
- Patent number 7,230,204
- Issue date Jun 12, 2007
- Tokyo Electron Limited
- Andrej Mitrovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improved plasma processing uniformity
- Patent number 7,164,236
- Issue date Jan 16, 2007
- Tokyo Electron Limited
- Andrej S. Mitrovic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPERATURE CONTROLLED SUBSTRATE HOLDER HAVING EROSION RESISTANT IN...
- Publication number 20110011845
- Publication date Jan 20, 2011
- TOKYO ELECTRON LIMITED
- Yuji Tsukamoto
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
TEMPERATURE CONTROLLED SUBSTRATE HOLDER WITH NON-UNIFORM INSULATION...
- Publication number 20100078424
- Publication date Apr 1, 2010
- TOKYO ELECTRON LIMITED
- Yuji Tsukamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Temperature controlled substrate holder with non-uniform insulation...
- Publication number 20080083723
- Publication date Apr 10, 2008
- TOKYO ELECTRON LIMITED
- Yuji Tsukamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Temperature controlled substrate holder having erosion resistant in...
- Publication number 20080083724
- Publication date Apr 10, 2008
- TOKYO ELECTRON LIMITED
- Yuji Tsukamoto
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
METHOD FOR MULTI-STEP TEMPERATURE CONTROL OF A SUBSTRATE
- Publication number 20080073335
- Publication date Mar 27, 2008
- TOKYO ELECTRON LIMITED
- Yuji TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas distribution system for a post-etch treatment system
- Publication number 20070235137
- Publication date Oct 11, 2007
- TOKYO ELECTON LIMITED
- Yuji Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-etch treatment system for removing residue on a substrate
- Publication number 20070235138
- Publication date Oct 11, 2007
- TOKYO ELECTON LIMITED
- Yuji Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for substrate temperature profile control
- Publication number 20060027169
- Publication date Feb 9, 2006
- TOKYO ELECTRON LIMITED
- Yuji Tsukamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for improved plasma processing uniformity
- Publication number 20040168770
- Publication date Sep 2, 2004
- TOKYO ELECTRON LIMITED
- Andrej S. Mitrovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improved plasma processing uniformity
- Publication number 20030137251
- Publication date Jul 24, 2003
- Andrej S. Mitrovic
- H01 - BASIC ELECTRIC ELEMENTS

Yuji Tsukamoto

Person

Patents Grantslast 30 patents

Temperature controlled substrate holder having erosion resistant in...

Temperature controlled substrate holder with non-uniform insulation...

Post-etch treatment system for removing residue on a substrate

Gas distribution system for a post-etch treatment system

Method for multi-step temperature control of a substrate

Temperature controlled substrate holder having erosion resistant in...

Temperature controlled substrate holder with non-uniform insulation...

Method for multi-step temperature control of a substrate

Method and system for temperature control of a substrate

Method and apparatus for improved plasma processing uniformity

Patents Applicationslast 30 patents

TEMPERATURE CONTROLLED SUBSTRATE HOLDER HAVING EROSION RESISTANT IN...

TEMPERATURE CONTROLLED SUBSTRATE HOLDER WITH NON-UNIFORM INSULATION...

Temperature controlled substrate holder with non-uniform insulation...

Temperature controlled substrate holder having erosion resistant in...

METHOD FOR MULTI-STEP TEMPERATURE CONTROL OF A SUBSTRATE

Gas distribution system for a post-etch treatment system

Post-etch treatment system for removing residue on a substrate

Method and system for substrate temperature profile control

Method and apparatus for improved plasma processing uniformity

Method and apparatus for improved plasma processing uniformity