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Yujuan TAO

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  • Nantong, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    System-level packaging structures
    • Patent number 10,741,499
    • Issue date Aug 11, 2020
    • TONGFU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D system-level packaging methods and structures
    • Patent number 10,515,883
    • Issue date Dec 24, 2019
    • TONGFU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3D system-level packaging methods and structures
    • Patent number 9,595,490
    • Issue date Mar 14, 2017
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Metal contact for semiconductor device
    • Patent number 9,548,282
    • Issue date Jan 17, 2017
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Chang-Ming Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    System-level packaging methods and structures
    • Patent number 9,543,269
    • Issue date Jan 10, 2017
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging structure
    • Patent number 9,497,862
    • Issue date Nov 15, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package structure
    • Patent number 9,485,868
    • Issue date Nov 1, 2016
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for forming package structure
    • Patent number 9,397,070
    • Issue date Jul 19, 2016
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for chip package
    • Patent number 9,362,173
    • Issue date Jun 7, 2016
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Packaging method
    • Patent number 9,324,583
    • Issue date Apr 26, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fan-out high-density packaging methods and structures
    • Patent number 9,287,205
    • Issue date Mar 15, 2016
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Lei Shi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Three-dimensional system-level packaging methods and structures
    • Patent number 9,099,448
    • Issue date Aug 4, 2015
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Fan-out high-density packaging methods and structures
    • Patent number 9,040,347
    • Issue date May 26, 2015
    • NANTONG FUJITSU MICROELECTRONICS CO., LTD.
    • Yujuan Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for chip packaging
    • Patent number 8,883,627
    • Issue date Nov 11, 2014
    • Nantong Fujitsu Microelectronics Co., Ltd.
    • Lei Shi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents