Yuk Cheung Au

Person

Kowloon, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus comprising an inert gas environment
- Patent number 10,475,763
- Issue date Nov 12, 2019
- ASM Technology Singapore Pte. Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal die detachment apparatus
- Patent number 8,470,130
- Issue date Jun 25, 2013
- ASM Assembly Automation LTD
- Chi Ming Chong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device for thin die detachment and pick-up
- Patent number 8,141,612
- Issue date Mar 27, 2012
- ASM Assembly Automation LTD
- Man Wai Chan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for generating amplified cooling air flows
- Patent number 7,667,355
- Issue date Feb 23, 2010
- ASM Assembly Automation LTD
- Yuk Cheung Au
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatus and method for alignment of a bonding tool
- Patent number 7,240,711
- Issue date Jul 10, 2007
- ASM Assembly Automation Ltd.
- Lai Wa Helen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer table for die bonding apparatus
- Patent number 6,543,513
- Issue date Apr 8, 2003
- ASM Assembly Automation Ltd.
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid dispensing apparatus
- Patent number 6,367,669
- Issue date Apr 9, 2002
- ASM Assembly Automation LTD
- Yuk Cheung Au
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
- Publication number 20160351527
- Publication date Dec 1, 2016
- ASM Technology Singapore Pte Ltd
- Siu Wing LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL DIE DETACHMENT APPARATUS
- Publication number 20110088845
- Publication date Apr 21, 2011
- Chi Ming CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR THIN DIE DETACHMENT AND PICK-UP
- Publication number 20100252205
- Publication date Oct 7, 2010
- Man Wai CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR GENERATING AMPLIFIED COOLING AIR FLOWS
- Publication number 20090195088
- Publication date Aug 6, 2009
- Yuk Cheung AU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Apparatus and method for alignment of a bonding tool
- Publication number 20050155712
- Publication date Jul 21, 2005
- ASM Assembly Automation Ltd
- Lai Wa Helen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for indexing and severing film
- Publication number 20050034577
- Publication date Feb 17, 2005
- ASM Assembly Automation Ltd
- Yuk Cheung Au
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-pin epoxy writing apparatus
- Publication number 20030044534
- Publication date Mar 6, 2003
- Siu Wing Lau
- H01 - BASIC ELECTRIC ELEMENTS

Yuk Cheung Au

Person

Patents Grantslast 30 patents

Die bonding apparatus comprising an inert gas environment

Universal die detachment apparatus

Device for thin die detachment and pick-up

Apparatus for generating amplified cooling air flows

Apparatus and method for alignment of a bonding tool

Wafer table for die bonding apparatus

Fluid dispensing apparatus

Patents Applicationslast 30 patents

DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT

UNIVERSAL DIE DETACHMENT APPARATUS

DEVICE FOR THIN DIE DETACHMENT AND PICK-UP

APPARATUS FOR GENERATING AMPLIFIED COOLING AIR FLOWS

Apparatus and method for alignment of a bonding tool

Apparatus and method for indexing and severing film

Multi-pin epoxy writing apparatus