Yukari Chino

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board, laminated wiring board, and semiconductor device
- Patent number 10,905,005
- Issue date Jan 26, 2021
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,293,406
- Issue date Mar 22, 2016
- Shinko Electric Industries Co., Ltd.
- Yukari Chino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency line structure for impedance matching a microstrip l...
- Patent number 8,552,815
- Issue date Oct 8, 2013
- Shinko Electric Industries Co., Ltd.
- Tomoharu Fujii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20230171883
- Publication date Jun 1, 2023
- Shinko Electric Industries Co., Ltd.
- Yukari Chino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, LAMINATED WIRING BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20200092993
- Publication date Mar 19, 2020
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130328212
- Publication date Dec 12, 2013
- Yukari CHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY LINE STRUCTURE ON RESIN SUBSTRATE AND METHOD OF MANU...
- Publication number 20100308941
- Publication date Dec 9, 2010
- Shinko Electric Industries Co., Ltd.
- Tomoharu Fujii
- H01 - BASIC ELECTRIC ELEMENTS