Yuki ANTOKU

Person

Saga-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
- Patent number 11,876,066
- Issue date Jan 16, 2024
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold-coated silver bonding wire and manufacturing method thereof, a...
- Patent number 11,289,442
- Issue date Mar 29, 2022
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding, and semiconductor...
- Patent number 11,251,153
- Issue date Feb 15, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium (Pd)-coated copper wire for ball bonding
- Patent number 10,195,697
- Issue date Feb 5, 2019
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki Amano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver—gold alloy bonding wire
- Patent number 9,362,249
- Issue date Jun 7, 2016
- Tanaka Denshi Kogyo K.K.
- Kazuhiko Yasuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ag—Au—Pd ternary alloy bonding wire
- Patent number 9,103,001
- Issue date Aug 11, 2015
- Tanaka Denshi Kogyo K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...
- Publication number 20220005781
- Publication date Jan 6, 2022
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...
- Publication number 20210366867
- Publication date Nov 25, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...
- Publication number 20200395330
- Publication date Dec 17, 2020
- TANAKA DENSHI KOGYO K.K.
- Jun CHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD-COATED SILVER BONDING WIRE AND MANUFACTURING METHOD THEREOF, A...
- Publication number 20200350273
- Publication date Nov 5, 2020
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOBLE METAL-COATED COPPER WIRE FOR BALL BONDING
- Publication number 20170125135
- Publication date May 4, 2017
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM (PD)-COATED COPPER WIRE FOR BALL BONDING
- Publication number 20170057020
- Publication date Mar 2, 2017
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-GOLD ALLOY BONDING WIRE
- Publication number 20160093586
- Publication date Mar 31, 2016
- TANAKA DENSHI KOGYO K.K.
- Kazuhiko YASUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
- Publication number 20140302317
- Publication date Oct 9, 2014
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag-Au-Pd TERNARY ALLOY BONDING WIRE
- Publication number 20120263624
- Publication date Oct 18, 2012
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Yuki ANTOKU

Person

Patents Grantslast 30 patents

Palladium-coated copper bonding wire, manufacturing method of palla...

Palladium-coated copper bonding wire and method for manufacturing same

Palladium-coated copper bonding wire, wire bonding structure, semic...

Noble metal-coated silver wire for ball bonding and method for prod...

Gold-coated silver bonding wire and manufacturing method thereof, a...

Noble metal-coated silver wire for ball bonding, and semiconductor...

Palladium (Pd)-coated copper wire for ball bonding

Bonding wire for high-speed signal line

Silver—gold alloy bonding wire

Ag—Au—Pd ternary alloy bonding wire

Patents Applicationslast 30 patents

PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLA...

PALLADIUM-COATED COPPER BONDING WIRE, WIRE BONDING STRUCTURE, SEMIC...

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

NOBLE METAL-COATED SILVER WIRE FOR BALL BONDING AND METHOD FOR PROD...

GOLD-COATED SILVER BONDING WIRE AND MANUFACTURING METHOD THEREOF, A...

NOBLE METAL-COATED COPPER WIRE FOR BALL BONDING

PALLADIUM (PD)-COATED COPPER WIRE FOR BALL BONDING

SILVER-GOLD ALLOY BONDING WIRE

BONDING WIRE FOR HIGH-SPEED SIGNAL LINE

Ag-Au-Pd TERNARY ALLOY BONDING WIRE