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Yuki IKKU
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Laser reflow apparatus and laser reflow method
Patent number
11,935,863
Issue date
Mar 19, 2024
Disco Corporation
Satoshi Kobayashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Processing method of wafer
Patent number
11,610,816
Issue date
Mar 21, 2023
Disco Corporation
Yuki Ikku
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method
Patent number
11,456,260
Issue date
Sep 27, 2022
Disco Corporation
Shunsuke Teranishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer processing method
Patent number
11,417,570
Issue date
Aug 16, 2022
Disco Corporation
Shunsuke Teranishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-destructive detection method
Patent number
10,557,704
Issue date
Feb 11, 2020
Disco Corporation
Shuichiro Tsukiji
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
PROCESSING METHOD OF WAFER
Publication number
20250014949
Publication date
Jan 9, 2025
Disco Corporation
Akira MIZUTANI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER BEAM APPLYING APPARATUS
Publication number
20230278125
Publication date
Sep 7, 2023
Disco Corporation
Teppei NOMURA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER REFLOW METHOD
Publication number
20230256546
Publication date
Aug 17, 2023
Disco Corporation
Teppei NOMURA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER BEAM IRRADIATING APPARATUS
Publication number
20230241714
Publication date
Aug 3, 2023
Disco Corporation
Teppei NOMURA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE MANUFACTURING METHOD
Publication number
20230219256
Publication date
Jul 13, 2023
Disco Corporation
Yuki IKKU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ADJUSTMENT METHOD OF LASER PROCESSING APPARATUS, AND LASER PROCESSI...
Publication number
20220339737
Publication date
Oct 27, 2022
Disco Corporation
Yuki IKKU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRODE WELDING METHOD AND ELECTRODE WELDING APPARATUS
Publication number
20220226934
Publication date
Jul 21, 2022
Disco Corporation
Yuki IKKU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20210265279
Publication date
Aug 26, 2021
Disco Corporation
Shunsuke TERANISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING METHOD OF WAFER
Publication number
20210265210
Publication date
Aug 26, 2021
Disco Corporation
Yuki IKKU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20210265212
Publication date
Aug 26, 2021
Disco Corporation
Shunsuke TERANISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER REFLOW APPARATUS AND LASER REFLOW METHOD
Publication number
20210202431
Publication date
Jul 1, 2021
Disco Corporation
Satoshi KOBAYASHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
NON-DESTRUCTIVE DETECTION METHOD
Publication number
20190242694
Publication date
Aug 8, 2019
Disco Corporation
Shuichiro TSUKIJI
G01 - MEASURING TESTING