Yuki Inoue

Person

Fukushima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-clad laminate, wiring board, and copper foil with resin
- Patent number 12,109,779
- Issue date Oct 8, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate, wiring board, and copper foil provided with r...
- Patent number 11,895,770
- Issue date Feb 6, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, film including resin, metal foil includ...
- Patent number 11,312,858
- Issue date Apr 26, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminated board, method for producing metal-clad laminat...
- Patent number 11,267,225
- Issue date Mar 8, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Arisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminate and metal foil with resin
- Patent number 11,254,100
- Issue date Feb 22, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal-clad laminate, metal member with resin, and wiring board
- Patent number 10,820,413
- Issue date Oct 27, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN
- Publication number 20230054257
- Publication date Feb 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki INOUE
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL PROVIDED WITH R...
- Publication number 20220015230
- Publication date Jan 13, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM INCLUDING RESIN, METAL FOIL INCLUD...
- Publication number 20210079215
- Publication date Mar 18, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Tatsuya ARISAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL-CLAD LAMINATED BOARD, METHOD FOR PRODUCING METAL-CLAD LAMINAT...
- Publication number 20190270280
- Publication date Sep 5, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TATSUYA ARISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD LAMINATE, METAL MEMBER WITH RESIN, AND WIRING BOARD
- Publication number 20190014661
- Publication date Jan 10, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- YUKI INOUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METAL-CLAD LAMINATE AND METAL FOIL WITH RESIN
- Publication number 20180297329
- Publication date Oct 18, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki Kitai
- B32 - LAYERED PRODUCTS

Person

Patents Grantslast 30 patents

Copper-clad laminate, wiring board, and copper foil with resin

Copper-clad laminate, wiring board, and copper foil provided with r...

Resin composition, prepreg, film including resin, metal foil includ...

Metal-clad laminated board, method for producing metal-clad laminat...

Metal-clad laminate and metal foil with resin

Metal-clad laminate, metal member with resin, and wiring board

Patents Applicationslast 30 patents

COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN

COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL PROVIDED WITH R...

RESIN COMPOSITION, PREPREG, FILM INCLUDING RESIN, METAL FOIL INCLUD...

METAL-CLAD LAMINATED BOARD, METHOD FOR PRODUCING METAL-CLAD LAMINAT...

METAL-CLAD LAMINATE, METAL MEMBER WITH RESIN, AND WIRING BOARD

METAL-CLAD LAMINATE AND METAL FOIL WITH RESIN