Yuki ITO

Person

Okegawa-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pure copper plate, copper/ceramic bonded body, and insulated circui...
- Patent number 12,035,469
- Issue date Jul 9, 2024
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper alloy plate, copper alloy plate with plating film, and manuf...
- Patent number 11,795,525
- Issue date Oct 24, 2023
- Mitsubishi Materials Corporation
- Naoki Miyashima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper alloy, copper alloy plastic-processed material, component fo...
- Patent number 11,732,329
- Issue date Aug 22, 2023
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic/electrical devices, copper alloy planar...
- Patent number 11,725,258
- Issue date Aug 15, 2023
- Mitsubishi Materials Corporation
- Hirotaka Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Superconductivity stabilizing material, superconducting wire and su...
- Patent number 11,613,794
- Issue date Mar 28, 2023
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy powder having excellent laser absorptivity
- Patent number 11,351,601
- Issue date Jun 7, 2022
- Mitsubishi Materials Corporation
- Jun Kato
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Stabilizer material for superconductor
- Patent number 11,149,329
- Issue date Oct 19, 2021
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting wire and superconducting coil
- Patent number 10,971,278
- Issue date Apr 6, 2021
- Mitsubishi Materials Corporation
- Kosei Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy and copper alloy forming material
- Patent number 10,458,003
- Issue date Oct 29, 2019
- Mitsubishi Materials Corporation
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic and electrical equipment, plastically w...
- Patent number 10,294,547
- Issue date May 21, 2019
- Mitsubishi Materials Corporation
- Yuki Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy for electronic/electric device, copper alloy plastic w...
- Patent number 10,157,694
- Issue date Dec 18, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic devices, method of manufacturing copper...
- Patent number 10,153,063
- Issue date Dec 11, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy for electronic device, method for producing copper all...
- Patent number 10,056,165
- Issue date Aug 21, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic device, method for producing copper all...
- Patent number 10,032,536
- Issue date Jul 24, 2018
- Mitsubishi Materials Corporation
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper alloy for electronic equipment, method for producing copper...
- Patent number 9,587,299
- Issue date Mar 7, 2017
- Mitsubishi Materials Corporation
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
PURE COPPER PLATE
- Publication number 20240124954
- Publication date Apr 18, 2024
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...
- Publication number 20230313341
- Publication date Oct 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...
- Publication number 20230243020
- Publication date Aug 3, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C21 - METALLURGY OF IRON
Information Patent Application
PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...
- Publication number 20230114969
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PURE COPPER PLATE
- Publication number 20230112081
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...
- Publication number 20230090953
- Publication date Mar 23, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC-PROCESSED MATERIAL, COMPONENT FO...
- Publication number 20230002860
- Publication date Jan 5, 2023
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, ELECTRONIC/ELE...
- Publication number 20220403485
- Publication date Dec 22, 2022
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...
- Publication number 20220396853
- Publication date Dec 15, 2022
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICES, COPPER ALLOY PLANAR...
- Publication number 20220341000
- Publication date Oct 27, 2022
- MITSUBISHI MATERIALS CORPORATION
- Hirotaka MATSUNAGA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...
- Publication number 20220145424
- Publication date May 12, 2022
- MITSUBISHI MATERIALS CORPORATION
- Naoki Miyashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PURE COPPER PLATE
- Publication number 20220025486
- Publication date Jan 27, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yuki ITO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY POWDER HAVING EXCELLENT LASER ABSORPTIVITY
- Publication number 20200398337
- Publication date Dec 24, 2020
- MITSUBISHI MATERIALS CORPORATION
- Jun KATO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUPERCONDUCTIVITY STABILIZING MATERIAL, SUPERCONDUCTING WIRE AND SU...
- Publication number 20200340079
- Publication date Oct 29, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SUPERCONDUCTING STABILIZER, SUPERCONDUCTING WIRE AND SUPERCONDUCTIN...
- Publication number 20200002787
- Publication date Jan 2, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUPERCONDUCTING STABILIZER
- Publication number 20190338396
- Publication date Nov 7, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL
- Publication number 20190066865
- Publication date Feb 28, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kosei FUKUOKA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICE, COMPONENT FOR ELEC...
- Publication number 20180245183
- Publication date Aug 30, 2018
- MITSUBISHI MATERIALS CORPORATION
- Kazunari MAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY PLASTIC W...
- Publication number 20170178761
- Publication date Jun 22, 2017
- MITSUBISHI MATERIALS CORPORATION
- Yuki ITO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER...
- Publication number 20170130309
- Publication date May 11, 2017
- MITSUBISHI MATERIALS CORPORATION
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, PLASTICALLY W...
- Publication number 20160160321
- Publication date Jun 9, 2016
- MITSUBISHI MATERIALS CORPORATION
- Yuki Ito
- C21 - METALLURGY OF IRON
Information Patent Application
COPPER ALLOY AND COPPER ALLOY FORMING MATERIAL
- Publication number 20140290805
- Publication date Oct 2, 2014
- MITSUBISHI MATERIALS CORPORATION
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER...
- Publication number 20140283961
- Publication date Sep 25, 2014
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD OF MANUFACTURING COPPER...
- Publication number 20140283962
- Publication date Sep 25, 2014
- MITSUBISHI MATERIALS CORPORATION
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALL...
- Publication number 20140271339
- Publication date Sep 18, 2014
- MITSUBISHI MATERIALS CORPORATION
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY WITH HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY
- Publication number 20140227128
- Publication date Aug 14, 2014
- MITSUBISHI MATERIALS CORPORATION
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD FOR PRODUCING COPPER AL...
- Publication number 20140096877
- Publication date Apr 10, 2014
- MITSUBISHI MATERIALS CORPORATION
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLO...
- Publication number 20130284327
- Publication date Oct 31, 2013
- MITSUBISHI MATERIALS CORPORATION
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLO...
- Publication number 20130056116
- Publication date Mar 7, 2013
- MITSUBISHI MATERIALS CORPORATION
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALL...
- Publication number 20130048162
- Publication date Feb 28, 2013
- MITSUBISHI MATERIALS CORPORATION
- Yuki Ito
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Person

Patents Grantslast 30 patents

Pure copper plate, copper/ceramic bonded body, and insulated circui...

Copper alloy plate, copper alloy plate with plating film, and manuf...

Copper alloy, copper alloy plastic-processed material, component fo...

Copper alloy for electronic/electrical devices, copper alloy planar...

Superconductivity stabilizing material, superconducting wire and su...

Copper alloy powder having excellent laser absorptivity

Stabilizer material for superconductor

Superconducting wire and superconducting coil

Copper alloy and copper alloy forming material

Copper alloy for electronic and electrical equipment, plastically w...

Copper alloy for electronic/electric device, copper alloy plastic w...

Copper alloy for electronic devices, method of manufacturing copper...

Copper alloy for electronic device, method for producing copper all...

Copper alloy for electronic device, method for producing copper all...

Copper alloy for electronic equipment, method for producing copper...

Patents Applicationslast 30 patents

PURE COPPER PLATE

COPPER ALLOY PLASTIC WORKING MATERIAL, COPPER ALLOY ROD MATERIAL, C...

PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL,...

PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...

PURE COPPER PLATE

PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUI...

COPPER ALLOY, COPPER ALLOY PLASTIC-PROCESSED MATERIAL, COMPONENT FO...

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, ELECTRONIC/ELE...

COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR...

COPPER ALLOY FOR ELECTRONIC/ELECTRICAL DEVICES, COPPER ALLOY PLANAR...

COPPER ALLOY PLATE, COPPER ALLOY PLATE WITH PLATING FILM, AND MANUF...

PURE COPPER PLATE

COPPER ALLOY POWDER HAVING EXCELLENT LASER ABSORPTIVITY

SUPERCONDUCTIVITY STABILIZING MATERIAL, SUPERCONDUCTING WIRE AND SU...

SUPERCONDUCTING STABILIZER, SUPERCONDUCTING WIRE AND SUPERCONDUCTIN...

SUPERCONDUCTING STABILIZER

SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL

COPPER ALLOY FOR ELECTRONIC AND ELECTRIC DEVICE, COMPONENT FOR ELEC...

COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY PLASTIC W...

COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER...

COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, PLASTICALLY W...

COPPER ALLOY AND COPPER ALLOY FORMING MATERIAL

COPPER ALLOY FOR ELECTRONIC EQUIPMENT, METHOD FOR PRODUCING COPPER...

COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD OF MANUFACTURING COPPER...

COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALL...

COPPER ALLOY WITH HIGH STRENGTH AND HIGH ELECTRICAL CONDUCTIVITY

COPPER ALLOY FOR ELECTRONIC DEVICES, METHOD FOR PRODUCING COPPER AL...

COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLO...

COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLO...

COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING COPPER ALL...