Yuki KAWANA

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dynamic image analysis apparatus extracting specific frames includi...
- Patent number 12,131,468
- Issue date Oct 29, 2024
- Konica Minolta, Inc.
- Noritsugu Matsutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dynamic analysis system, correction apparatus, storage medium, and...
- Patent number 12,109,059
- Issue date Oct 8, 2024
- Konica Minolta, Inc.
- Sumiya Nagatsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,070,800
- Issue date Aug 27, 2024
- Resonac Corporation
- Yoshinori Ejiri
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing bonded object and semiconductor device and cop...
- Patent number 11,890,681
- Issue date Feb 6, 2024
- Resonac Corporation
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Dynamic image analysis apparatus extracting specific frames includi...
- Patent number 11,676,271
- Issue date Jun 13, 2023
- Konica Minolta, Inc.
- Noritsugu Matsutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing thermoelectric conversion module, thermoel...
- Patent number 11,575,076
- Issue date Feb 7, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Motohiro Negishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 11,532,588
- Issue date Dec 20, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing joined body, and joining material
- Patent number 11,483,936
- Issue date Oct 25, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,370,066
- Issue date Jun 28, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 11,040,416
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Dai Ishikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 10,930,612
- Issue date Feb 23, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for producing joined body, and met...
- Patent number 10,363,608
- Issue date Jul 30, 2019
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
DYNAMIC IMAGE ANALYSIS APPARATUS EXTRACTING SPECIFIC FRAMES INCLUDI...
- Publication number 20250014179
- Publication date Jan 9, 2025
- Konica Minolta, Inc.
- Noritsugu MATSUTANI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DYNAMIC ANALYSIS SYSTEM, CORRECTION APPARATUS, STORAGE MEDIUM, AND...
- Publication number 20240423568
- Publication date Dec 26, 2024
- Konica Minolta, Inc.
- Sumiya NAGATSUKA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD AND SYSTEM FOR FEDERATED LEARNING TRAINING FOR A NEURAL NETW...
- Publication number 20240256892
- Publication date Aug 1, 2024
- WOVEN BY TOYOTA, INC.
- Yuki KAWANA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR SELF-SUPERVISED FEDERATED LEARNING FOR AUTOMO...
- Publication number 20240220817
- Publication date Jul 4, 2024
- WOVEN BY TOYOTA, INC.
- Yuki KAWANA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR FEDERATED LEARNING FOR AUTOMOTIVE APPLICATION...
- Publication number 20240220816
- Publication date Jul 4, 2024
- WOVEN BY TOYOTA, INC.
- Yuki Kawana
- B60 - VEHICLES IN GENERAL
Information Patent Application
DYNAMIC IMAGE ANALYSIS APPARATUS EXTRACTING SPECIFIC FRAMES INCLUDI...
- Publication number 20230260118
- Publication date Aug 17, 2023
- Konica Minolta, Inc.
- Noritsugu MATSUTANI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20220371087
- Publication date Nov 24, 2022
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRA...
- Publication number 20220230918
- Publication date Jul 21, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220053647
- Publication date Feb 17, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinori EJIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...
- Publication number 20220028824
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DYNAMIC ANALYSIS SYSTEM, CORRECTION APPARATUS, STORAGE MEDIUM, AND...
- Publication number 20210361250
- Publication date Nov 25, 2021
- Konica Minolta, Inc.
- Sumiya NAGATSUKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMBER CONNECTION METHOD
- Publication number 20210351157
- Publication date Nov 11, 2021
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20210143121
- Publication date May 13, 2021
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE MEDIUM, DYNAMIC ANALYSIS APPARATUS, AND DYNAMIC ANALYSIS SY...
- Publication number 20210133967
- Publication date May 6, 2021
- Konica Minolta, Inc.
- Noritsugu MATSUTANI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL
- Publication number 20200344893
- Publication date Oct 29, 2020
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...
- Publication number 20200295248
- Publication date Sep 17, 2020
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200130109
- Publication date Apr 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200108471
- Publication date Apr 9, 2020
- Hitachi Chemical Company, Ltd.
- Dai ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20190355690
- Publication date Nov 21, 2019
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION IMAGE PHOTOGRAPHING APPARATUS AND RADIATION IMAGE PHOTOGR...
- Publication number 20190257961
- Publication date Aug 22, 2019
- Konica Minolta, Inc.
- Yuki KAWANA
- G01 - MEASURING TESTING
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...
- Publication number 20180250751
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
RADIOGRAPHIC IMAGE CAPTURING SYSTEM AND RADIOGRAPHIC IMAGE CAPTURIN...
- Publication number 20170303883
- Publication date Oct 26, 2017
- Konica Minolta, Inc.
- Yuki KAWANA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Yuki KAWANA

Person

Patents Grantslast 30 patents

Dynamic image analysis apparatus extracting specific frames includi...

Dynamic analysis system, correction apparatus, storage medium, and...

Electronic component and method for manufacturing electronic component

Method for producing bonded object and semiconductor device and cop...

Member connection method

Dynamic image analysis apparatus extracting specific frames includi...

Method for manufacturing thermoelectric conversion module, thermoel...

Copper paste for pressureless bonding, bonded body and semiconducto...

Method for producing joined body, and joining material

Metal paste for joints, assembly, production method for assembly, s...

Metal paste for joints, assembly, production method for assembly, s...

Copper paste for joining, method for manufacturing joined body, and...

Copper paste for pressureless bonding, bonded body and semiconducto...

Copper paste for joining, method for manufacturing joined body, and...

Assembly and semiconductor device

Copper paste for joining, method for producing joined body, and met...

Patents Applicationslast 30 patents

DYNAMIC IMAGE ANALYSIS APPARATUS EXTRACTING SPECIFIC FRAMES INCLUDI...

DYNAMIC ANALYSIS SYSTEM, CORRECTION APPARATUS, STORAGE MEDIUM, AND...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHOD AND SYSTEM FOR FEDERATED LEARNING TRAINING FOR A NEURAL NETW...

SYSTEM AND METHOD FOR SELF-SUPERVISED FEDERATED LEARNING FOR AUTOMO...

SYSTEM AND METHOD FOR FEDERATED LEARNING FOR AUTOMOTIVE APPLICATION...

DYNAMIC IMAGE ANALYSIS APPARATUS EXTRACTING SPECIFIC FRAMES INCLUDI...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRA...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...

DYNAMIC ANALYSIS SYSTEM, CORRECTION APPARATUS, STORAGE MEDIUM, AND...

MEMBER CONNECTION METHOD

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

STORAGE MEDIUM, DYNAMIC ANALYSIS APPARATUS, AND DYNAMIC ANALYSIS SY...

METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL

METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

RADIATION IMAGE PHOTOGRAPHING APPARATUS AND RADIATION IMAGE PHOTOGR...

ASSEMBLY AND SEMICONDUCTOR DEVICE

COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...

RADIOGRAPHIC IMAGE CAPTURING SYSTEM AND RADIOGRAPHIC IMAGE CAPTURIN...