Yuki Momokawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 7,964,963
- Issue date Jun 21, 2011
- NEC Corporation
- Yuki Momokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 7,273,988
- Issue date Sep 25, 2007
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 6,878,884
- Issue date Apr 12, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PASTE AND SOLDER JOINT
- Publication number 20190308282
- Publication date Oct 10, 2019
- NEC Corporation
- Yuki MOMOKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20090315176
- Publication date Dec 24, 2009
- Yuki Momokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD,METHOD OF MOUNTING SURFACE MOUNTING COMPONENT ON CIRC...
- Publication number 20070102490
- Publication date May 10, 2007
- NEC Corporation
- Yuki Momokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050230147
- Publication date Oct 20, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050146019
- Publication date Jul 7, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board, circuit board mounting method, and electronic device...
- Publication number 20040238211
- Publication date Dec 2, 2004
- Yuki Momokawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20030196831
- Publication date Oct 23, 2003
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yuki Momokawa

Person

Patents Grantslast 30 patents

Semiconductor package and method for manufacturing semiconductor pa...

Wiring board, and electronic device with an electronic part mounted...

Wiring board, and electronic device with an electronic part mounted...

Patents Applicationslast 30 patents

SOLDER PASTE AND SOLDER JOINT

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

CIRCUIT BOARD,METHOD OF MOUNTING SURFACE MOUNTING COMPONENT ON CIRC...

Wiring board, and electronic device with an electronic part mounted...

Wiring board, and electronic device with an electronic part mounted...

Circuit board, circuit board mounting method, and electronic device...

Wiring board, and electronic device with an electronic part mounted...