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Yuki NITTA
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of producing circuit boards
Patent number
11,974,404
Issue date
Apr 30, 2024
TOPPAN INC.
Yuki Nitta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of dicing wiring substrate, and packaging substrate
Patent number
11,081,368
Issue date
Aug 3, 2021
Toppan Printing Co., Ltd.
Koji Imayoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of dicing wiring substrate, and packaging substrate
Patent number
10,679,865
Issue date
Jun 9, 2020
Toppan Printing Co., Ltd.
Koji Imayoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging substrate and method of fabricating the same
Patent number
10,204,854
Issue date
Feb 12, 2019
Toppan Printing Co., Ltd.
Yuki Nitta
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...
Publication number
20230395395
Publication date
Dec 7, 2023
TOPPAN INC.
Takashi KIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING CIRCUIT BOARDS
Publication number
20220078921
Publication date
Mar 10, 2022
TOPPAN INC.
Yuki NITTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DICING WIRING SUBSTRATE, AND PACKAGING SUBSTRATE
Publication number
20200266077
Publication date
Aug 20, 2020
Toppan Printing Co., Ltd.
Koji IMAYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DICING WIRING SUBSTRATE, AND PACKAGING SUBSTRATE
Publication number
20190304804
Publication date
Oct 3, 2019
Toppan Printing Co., Ltd.
Koji IMAYOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
Publication number
20180294217
Publication date
Oct 11, 2018
Toppan Printing Co., Ltd.
Yuki NITTA
H01 - BASIC ELECTRIC ELEMENTS