Yuki SEKINE

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,004,821
- Issue date May 11, 2021
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discharge examination device, wire-bonding apparatus, and discharge...
- Patent number 10,607,959
- Issue date Mar 31, 2020
- Shinkawa Ltd.
- Kazumasa Sasakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless terminal, information providing method, and information pr...
- Patent number 9,467,929
- Issue date Oct 11, 2016
- YAHOO JAPAN CORPORATION
- Yuki Sekine
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING APPARATUS
- Publication number 20190287941
- Publication date Sep 19, 2019
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...
- Publication number 20160358879
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- KAZUMASA SASAKURA
- G01 - MEASURING TESTING
Information Patent Application
WIRELESS TERMINAL, INFORMATION PROVIDING METHOD, AND INFORMATION PR...
- Publication number 20140211645
- Publication date Jul 31, 2014
- Yahoo Japan Corporation
- Yuki SEKINE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE