Yuki SUTO

Person

Sakura-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Evaluation device of radio communication module
- Patent number 12,092,675
- Issue date Sep 17, 2024
- Fujikura Ltd.
- Yuki Suto
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor
- Patent number 10,254,184
- Issue date Apr 9, 2019
- Fujikura Ltd.
- Naoki Takayama
- G01 - MEASURING TESTING
Information Patent Grant
Wiring body assembly, structure with conductor layer, and touch sensor
- Patent number 9,983,448
- Issue date May 29, 2018
- Fujikura Ltd.
- Yuki Suto
- G02 - OPTICS
Information Patent Grant
Pressure sensor
- Patent number D741734
- Issue date Oct 27, 2015
- Fujikura Ltd.
- Michikazu Tomita
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Pressure sensor
- Patent number D731342
- Issue date Jun 9, 2015
- Fujikura Ltd.
- Michikazu Tomita
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Pressure sensor
- Patent number D729084
- Issue date May 12, 2015
- Fujikura Ltd.
- Michikazu Tomita
- D10 - Measuring, testing, or signalling instruments
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 8,530,979
- Issue date Sep 10, 2013
- Fujikura Ltd.
- Shingo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,330,268
- Issue date Dec 11, 2012
- Fujikura Ltd.
- Yuki Suto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OUTPUT CONTROL METHOD OF RADIO COMMUNICATION MODULE, MANUFACTURING...
- Publication number 20240250703
- Publication date Jul 25, 2024
- FUJIKURA LTD.
- Taku Uchida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRELESS MODULE
- Publication number 20240250405
- Publication date Jul 25, 2024
- FUJIKURA LTD.
- Noriaki Shigematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODULE
- Publication number 20240250401
- Publication date Jul 25, 2024
- FUJIKURA LTD.
- Noriaki Shigematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EVALUATION DEVICE OF RADIO COMMUNICATION MODULE
- Publication number 20230236230
- Publication date Jul 27, 2023
- FUJIKURA LTD.
- Yuki Suto
- G01 - MEASURING TESTING
Information Patent Application
EVALUATION DEVICE OF RADIO COMMUNICATION MODULE
- Publication number 20230228799
- Publication date Jul 20, 2023
- FUJIKURA LTD.
- Yuki Suto
- G01 - MEASURING TESTING
Information Patent Application
WIRING BODY ASSEMBLY, WIRING STRUCTURE, AND TOUCH SENSOR
- Publication number 20200301542
- Publication date Sep 24, 2020
- FUJIKURA LTD.
- Yuki Suto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BODY ASSEMBLY, WIRING BOARD, AND TOUCH SENSOR
- Publication number 20200064971
- Publication date Feb 27, 2020
- FUJIKURA LTD.
- Yuki Suto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BODY AND WIRING BODY ASSEMBLY
- Publication number 20200053879
- Publication date Feb 13, 2020
- FUJIKURA LTD.
- Yuki Suto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BODY ASSEMBLY, STRUCTURE WITH CONDUCTOR LAYER, AND TOUCH SENSOR
- Publication number 20170199412
- Publication date Jul 13, 2017
- FUJIKURA LTD.
- Yuki Suto
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR
- Publication number 20160209284
- Publication date Jul 21, 2016
- FUJIKURA LTD.
- Naoki TAKAYAMA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110018112
- Publication date Jan 27, 2011
- FUJIKURA LTD.
- Shingo OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100102437
- Publication date Apr 29, 2010
- FUJIKURA LTD.
- Yuki SUTO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Evaluation device of radio communication module

Semiconductor pressure sensor

Wiring body assembly, structure with conductor layer, and touch sensor

Pressure sensor

Pressure sensor

Pressure sensor

Semiconductor package and method for manufacturing the same

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

OUTPUT CONTROL METHOD OF RADIO COMMUNICATION MODULE, MANUFACTURING...

WIRELESS MODULE

WIRELESS MODULE

EVALUATION DEVICE OF RADIO COMMUNICATION MODULE

EVALUATION DEVICE OF RADIO COMMUNICATION MODULE

WIRING BODY ASSEMBLY, WIRING STRUCTURE, AND TOUCH SENSOR

WIRING BODY ASSEMBLY, WIRING BOARD, AND TOUCH SENSOR

WIRING BODY AND WIRING BODY ASSEMBLY

WIRING BODY ASSEMBLY, STRUCTURE WITH CONDUCTOR LAYER, AND TOUCH SENSOR

SEMICONDUCTOR PRESSURE SENSOR

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF