Yuki Tanaka

Person

Nishigo-mura, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier for double-side polishing apparatus, double-side polishing...
- Patent number 11,453,098
- Issue date Sep 27, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Double-side polishing method and double-side polishing apparatus
- Patent number 11,325,220
- Issue date May 10, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method for double-side polishing wafer
- Patent number 11,298,796
- Issue date Apr 12, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of carrier for double-side polishing apparatus...
- Patent number 11,065,735
- Issue date Jul 20, 2021
- Shin-Etsu Handotai Co., Ltd.
- Daichi Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for polishing silicon wafer
- Patent number 10,913,137
- Issue date Feb 9, 2021
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for raising polishing pad and polishing method
- Patent number 10,307,885
- Issue date Jun 4, 2019
- Shin-Etsu Handotai Co., Ltd.
- Takuya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating polishing pad and method for polishing wafer
- Patent number 10,118,272
- Issue date Nov 6, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of producing carrier for use in double-side polishing appara...
- Patent number 9,764,443
- Issue date Sep 19, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of double-side polishing wafer
- Patent number 9,266,215
- Issue date Feb 23, 2016
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SILICON WAFER MANUFACTURING METHOD
- Publication number 20240203745
- Publication date Jun 20, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR A SUBSTRATE WAFER
- Publication number 20230173633
- Publication date Jun 8, 2023
- Shin-Etsu Handotai Co., Ltd.
- Ryo TAGA
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING METHOD
- Publication number 20220168865
- Publication date Jun 2, 2022
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SILICON WAFER
- Publication number 20200114488
- Publication date Apr 16, 2020
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...
- Publication number 20200061772
- Publication date Feb 27, 2020
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
- Publication number 20190047113
- Publication date Feb 14, 2019
- Shin-Etsu Handotai Co., Ltd.
- Daichi KITAZUME
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-SIDE POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
- Publication number 20180361530
- Publication date Dec 20, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DOUBLE-SIDE POLISHING WAFER
- Publication number 20180272497
- Publication date Sep 27, 2018
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR RAISING POLISHING PAD AND POLISHING METHOD
- Publication number 20170341204
- Publication date Nov 30, 2017
- Shin-Etsu Handotai Co., Ltd.
- Takuya SASAKI
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...
- Publication number 20170069502
- Publication date Mar 9, 2017
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR EVALUATING POLISHING PAD AND METHOD FOR POLISHING WAFER
- Publication number 20160193711
- Publication date Jul 7, 2016
- Shin-Etsu Handotai Co., Ltd.
- Yuki TANAKA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARA...
- Publication number 20150375363
- Publication date Dec 31, 2015
- Shin-Etsu Handotai Co., Ltd.
- Kazuya SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING WAFER
- Publication number 20150147942
- Publication date May 28, 2015
- Shin-Etsu Handotai Co., Ltd.
- Kazuya Sato
- H01 - BASIC ELECTRIC ELEMENTS

Yuki Tanaka

Person

Patents Grantslast 30 patents

Carrier for double-side polishing apparatus, double-side polishing...

Double-side polishing method and double-side polishing apparatus

Method for double-side polishing wafer

Manufacturing method of carrier for double-side polishing apparatus...

Method for polishing silicon wafer

Method for raising polishing pad and polishing method

Method for evaluating polishing pad and method for polishing wafer

Method of producing carrier for use in double-side polishing appara...

Method of double-side polishing wafer

Patents Applicationslast 30 patents

SILICON WAFER MANUFACTURING METHOD

MANUFACTURING METHOD FOR A SUBSTRATE WAFER

DOUBLE-SIDE POLISHING METHOD

METHOD FOR POLISHING SILICON WAFER

CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, DOUBLE-SIDE POLISHING...

MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...

DOUBLE-SIDE POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS

METHOD FOR DOUBLE-SIDE POLISHING WAFER

METHOD FOR RAISING POLISHING PAD AND POLISHING METHOD

MANUFACTURING METHOD OF CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS...

METHOD FOR EVALUATING POLISHING PAD AND METHOD FOR POLISHING WAFER

METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARA...

METHOD OF DOUBLE-SIDE POLISHING WAFER