Yukifumi Oyama

Follow

Person

Shiga-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Reduction in thickness of semiconductor component on substrate
- Patent number 7,682,936
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Toshihiko Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method for semiconductor parts on circuit substrate
- Patent number 7,674,651
- Issue date Mar 9, 2010
- International Business Machines Corporation
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE
- Publication number 20080150135
- Publication date Jun 26, 2008
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduction in Thickness of Semiconductor Component on Substrate
- Publication number 20080067653
- Publication date Mar 20, 2008
- International Business Machines Corporation
- Toshihiko Nishio
- H01 - BASIC ELECTRIC ELEMENTS