Yukihiko Toyoda

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer printed wiring board
- Patent number 9,040,843
- Issue date May 26, 2015
- Ibiden Co., Ltd.
- Yukihiko Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,533,943
- Issue date Sep 17, 2013
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,324,512
- Issue date Dec 4, 2012
- Ibiden Co., Ltd.
- Yukihiko Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,093,507
- Issue date Jan 10, 2012
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 8,030,577
- Issue date Oct 4, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,030,579
- Issue date Oct 4, 2011
- Ibiden Co., Ltd.
- Yukihiko Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,020,291
- Issue date Sep 20, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board
- Patent number 8,018,045
- Issue date Sep 13, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing a printed wiring board
- Patent number 8,006,377
- Issue date Aug 30, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 7,994,433
- Issue date Aug 9, 2011
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayered printed circuit board
- Patent number 7,916,492
- Issue date Mar 29, 2011
- Ibiden Co., Ltd.
- Hui Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board, solder resist composition, and...
- Patent number 7,910,836
- Issue date Mar 22, 2011
- Ibiden Co. Ltd.
- Hui Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for producing the same
- Patent number 7,535,095
- Issue date May 19, 2009
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board having a roughened surface formed on a metal l...
- Patent number 7,504,719
- Issue date Mar 17, 2009
- Ibiden Co., Ltd.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed wiring board
- Patent number 7,371,974
- Issue date May 13, 2008
- Ibiden Co., Ltd.
- Yukihiko Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130008701
- Publication date Jan 10, 2013
- IBIDEN CO., LTD.
- Yukihiko TOYODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20110108311
- Publication date May 12, 2011
- IBIDEN CO., LTD.
- Yukihiko TOYODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD
- Publication number 20100163288
- Publication date Jul 1, 2010
- IBIDEN CO., LTD.
- Hui ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090205857
- Publication date Aug 20, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090188708
- Publication date Jul 30, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090183904
- Publication date Jul 23, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20090090003
- Publication date Apr 9, 2009
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20080292852
- Publication date Nov 27, 2008
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20080289864
- Publication date Nov 27, 2008
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20080289176
- Publication date Nov 27, 2008
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20080190658
- Publication date Aug 14, 2008
- IBIDEN CO., LTD.
- Yukihiko TOYODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board, solder resist composition, mult...
- Publication number 20080041615
- Publication date Feb 21, 2008
- IBIDEN CO., LTD.
- Hui ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method for producing the same
- Publication number 20050258522
- Publication date Nov 24, 2005
- IBIDEN CO., LTD.
- Honchin En
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multilayered printed wiring board
- Publication number 20030178229
- Publication date Sep 25, 2003
- Yukihiko Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yukihiko Toyoda

Person

Patents Grantslast 30 patents

Multilayer printed wiring board

Printed wiring board and method for producing the same

Multilayer printed wiring board

Printed wiring board and method for producing the same

Printed wiring board and method for producing the same

Multilayer printed wiring board

Method of manufacturing a printed wiring board

Printed circuit board

Method for producing a printed wiring board

Printed wiring board and method for producing the same

Multilayered printed circuit board

Multilayered printed circuit board, solder resist composition, and...

Printed wiring board and method for producing the same

Printed wiring board having a roughened surface formed on a metal l...

Multilayer printed wiring board

Patents Applicationslast 30 patents

MULTILAYER PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD

MULTILAYERED PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME

MULTILAYER PRINTED WIRING BOARD

Multilayered printed circuit board, solder resist composition, mult...

Printed wiring board and method for producing the same

Multilayered printed wiring board