Yukihiro Kitamura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 9,944,565
- Issue date Apr 17, 2018
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding article and method for producing same
- Patent number 6,858,151
- Issue date Feb 22, 2005
- Dowa Mining Co., Ltd.
- Nobuyoshi Tsukaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board and power module
- Patent number 6,791,180
- Issue date Sep 14, 2004
- Dowa Mining Co., Ltd.
- Yukihiro Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding article and method for producing same
- Patent number 6,780,520
- Issue date Aug 24, 2004
- Dowa Mining Co., Ltd.
- Nobuyoshi Tsukaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum nitride sintered product
- Patent number 6,383,962
- Issue date May 7, 2002
- Asahi Techno Glass Corporation
- Yoshiki Obana
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230298961
- Publication date Sep 21, 2023
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268245
- Publication date Aug 24, 2023
- DOWA METALTECH CO., LTD.
- Seiya YUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200388553
- Publication date Dec 10, 2020
- FUJI ELECTRIC CO., LTD.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20150284296
- Publication date Oct 8, 2015
- Tokuyama Corporation
- Hideyo Osanai
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal-coated substrate and manufacturing method of the same
- Publication number 20060292383
- Publication date Dec 28, 2006
- Shuichi Kohayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal coated substrate and manufacturing method of the same
- Publication number 20060093838
- Publication date May 4, 2006
- DOWA MINING CO., LTD.
- Shuichi Kohayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for producing metal/ceramic bonding substrate
- Publication number 20040149689
- Publication date Aug 5, 2004
- Xiao-Shan Ning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal/ceramic bonding article and method for producing same
- Publication number 20030232204
- Publication date Dec 18, 2003
- Nobuyoshi Tsukaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Metal/ceramic bonding article and method for producing same
- Publication number 20030232205
- Publication date Dec 18, 2003
- Nobuyoshi Tsukaguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Ceramic circuit board and power module
- Publication number 20030173660
- Publication date Sep 18, 2003
- Yukihiro Kitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yukihiro Kitamura

Person

Patents Grantslast 30 patents

Semiconductor module and method for manufacturing same

Metal/ceramic bonding substrate and method for producing same

Metal/ceramic bonding article and method for producing same

Ceramic circuit board and power module

Metal/ceramic bonding article and method for producing same

Aluminum nitride sintered product

Patents Applicationslast 30 patents

INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

INSULATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

Metal-coated substrate and manufacturing method of the same

Metal coated substrate and manufacturing method of the same

Method for producing metal/ceramic bonding substrate

Metal/ceramic bonding article and method for producing same

Metal/ceramic bonding article and method for producing same

Ceramic circuit board and power module