Yukihiro Maeda

Person

Okazaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board with built-in semiconductor chip and method of manufa...
- Patent number 8,390,106
- Issue date Mar 5, 2013
- Denso Corporation
- Yukihiro Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for manufacturing the same, and multil...
- Patent number 8,148,809
- Issue date Apr 3, 2012
- Denso Corporation
- Kouji Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for manufacturing the same
- Patent number 7,209,367
- Issue date Apr 24, 2007
- Denso Corporation
- Tetsuo Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including bonded wire based to electronic part...
- Patent number 6,731,001
- Issue date May 4, 2004
- Denso Corporation
- Kan Kinouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device having metal pad bonded with metal wiring and man...
- Patent number 6,645,606
- Issue date Nov 11, 2003
- Denso Corporation
- Tetsuo Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting method
- Patent number 6,601,752
- Issue date Aug 5, 2003
- Denso Corporation
- Yukihiro Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method
- Patent number 6,079,610
- Issue date Jun 27, 2000
- Denso Corporation
- Yukihiro Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having a plurality of circuit boards arranged the...
- Patent number 5,657,203
- Issue date Aug 12, 1997
- Nippondenso Co., Ltd.
- Yasunobu Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a plurality of circuit boards arranged the...
- Patent number 5,646,827
- Issue date Jul 8, 1997
- Nippondenso Co., Ltd.
- Yasunobu Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Container for electronic devices having a plurality of circuit boards
- Patent number 5,408,383
- Issue date Apr 18, 1995
- Nippondenso Co., Ltd.
- Takashi Nagasaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD WITH BUILT-IN SEMICONDUCTOR CHIP AND METHOD OF MANUFA...
- Publication number 20110266666
- Publication date Nov 3, 2011
- DENSO CORPORATION
- Yukihiro Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, method for manufacturing the same, and multil...
- Publication number 20100176480
- Publication date Jul 15, 2010
- DENSO CORPORATION
- Kouji Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having metallic lead and electronic device hav...
- Publication number 20070075419
- Publication date Apr 5, 2007
- DENSO CORPORATION
- Yutaka Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic apparatus and method for manufacturing the same
- Publication number 20060234528
- Publication date Oct 19, 2006
- DENSO CORPORATION
- Tetsuo Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical device having metal pad bonded with metal wiring and man...
- Publication number 20020187319
- Publication date Dec 12, 2002
- Tetsuo Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including bonding wire bonded to electronic pa...
- Publication number 20020020910
- Publication date Feb 21, 2002
- Kan Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part mounting method
- Publication number 20010020635
- Publication date Sep 13, 2001
- Yukihiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Yukihiro Maeda

Person

Patents Grantslast 30 patents

Circuit board with built-in semiconductor chip and method of manufa...

Semiconductor device, method for manufacturing the same, and multil...

Electronic apparatus and method for manufacturing the same

Semiconductor device including bonded wire based to electronic part...

Electrical device having metal pad bonded with metal wiring and man...

Electronic part mounting method

Wire bonding method

Electronic device having a plurality of circuit boards arranged the...

Electronic device having a plurality of circuit boards arranged the...

Container for electronic devices having a plurality of circuit boards

Patents Applicationslast 30 patents

CIRCUIT BOARD WITH BUILT-IN SEMICONDUCTOR CHIP AND METHOD OF MANUFA...

Semiconductor device, method for manufacturing the same, and multil...

Semiconductor device having metallic lead and electronic device hav...

Electronic apparatus and method for manufacturing the same

Electrical device having metal pad bonded with metal wiring and man...

Semiconductor device including bonding wire bonded to electronic pa...

Electronic part mounting method