Yukihiro Mikogami

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
(Hetero)aromatic ether, (thio)ester or (thio)carbonate epoxy catalyst
- Patent number 6,096,836
- Issue date Aug 1, 2000
- Kabushiki Kaisha Toshiba
- Shuzi Hayase
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aromatic curing catalyst for epoxy resins
- Patent number 5,811,497
- Issue date Sep 22, 1998
- Kabushiki Kaisha Toshiba
- Shuzi Hayase
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide precursor, bismaleimide-based cured resin precursor and e...
- Patent number 5,578,697
- Issue date Nov 26, 1996
- Kabushiki Kaisha Toshiba
- Yoshiaki Kawamonzen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of forming polyimide film pattern
- Patent number 5,518,864
- Issue date May 21, 1996
- Kabushiki Kaisha Toshiba
- Masayuki Oba
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive composition comprising a polysilane and an acid form...
- Patent number 5,372,908
- Issue date Dec 13, 1994
- Kabushiki Kaisha Toshiba
- Shuji Hayase
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polysilane monomolecular film and polysilane built-up film
- Patent number 5,362,559
- Issue date Nov 8, 1994
- Kabushiki Kaisha Toshiba
- Shuji Hayase
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Photosensitive resin composition for forming polyimide film pattern...
- Patent number 5,348,835
- Issue date Sep 20, 1994
- Kabushiki Kaisha Toshiba
- Masayuki Oba
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive composition and resin-encapsulated semiconductor device
- Patent number 5,340,684
- Issue date Aug 23, 1994
- Kabushiki Kaisha Toshiba
- Rumiko Hayase
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polysilane and polysilane composition
- Patent number 5,336,736
- Issue date Aug 9, 1994
- Kabushiki Kaisha Toshiba
- Yoshihiko Nakano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition for forming a polyimide film pattern
- Patent number 5,176,982
- Issue date Jan 5, 1993
- Kabushiki Kaisha Toshiba
- Yukihiro Mikogami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition
- Patent number 4,829,134
- Issue date May 9, 1989
- Kabushiki Kaisha Toshiba
- Tsuguo Sakamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photocurable composition
- Patent number 4,816,496
- Issue date Mar 28, 1989
- Kabushiki Kaisha Toshiba
- Moriyasu Wada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Porous gas diffusion electrode and method of producing the same
- Patent number 4,555,324
- Issue date Nov 26, 1985
- Kabushiki Kaisha Toshiba
- Mitsushi Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-resistant thermosetting resin composition
- Patent number 4,309,512
- Issue date Jan 5, 1982
- Tokyo Shibaura Denki Kabushiki Kaisha
- Yukihiro Mikogami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yukihiro Mikogami

Person

Patents Grantslast 30 patents

(Hetero)aromatic ether, (thio)ester or (thio)carbonate epoxy catalyst

Aromatic curing catalyst for epoxy resins

Polyimide precursor, bismaleimide-based cured resin precursor and e...

Method of forming polyimide film pattern

Photosensitive composition comprising a polysilane and an acid form...

Polysilane monomolecular film and polysilane built-up film

Photosensitive resin composition for forming polyimide film pattern...

Photosensitive composition and resin-encapsulated semiconductor device

Polysilane and polysilane composition

Photosensitive resin composition for forming a polyimide film pattern

Epoxy resin composition

Photocurable composition

Porous gas diffusion electrode and method of producing the same

Heat-resistant thermosetting resin composition