Yukinobu Ohura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing protective film agent
- Patent number 11,637,033
- Issue date Apr 25, 2023
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film agent for laser dicing
- Patent number 11,322,383
- Issue date May 3, 2022
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film forming resin agent and laser processing method
- Patent number 10,858,524
- Issue date Dec 8, 2020
- Disco Corporation
- Yukinobu Ohura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wafer
- Patent number 10,811,458
- Issue date Oct 20, 2020
- Disco Corporation
- Ryugo Oba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film applying apparatus and protective film applying method
- Patent number 10,086,474
- Issue date Oct 2, 2018
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film detecting method
- Patent number 9,976,951
- Issue date May 22, 2018
- Disco Corporation
- Senichi Ryo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 9,847,257
- Issue date Dec 19, 2017
- Disco Corporation
- Yukinobu Ohura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,748,119
- Issue date Aug 29, 2017
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film detecting method for laser processing
- Patent number 9,689,798
- Issue date Jun 27, 2017
- Disco Corporation
- Senichi Ryo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing method
- Patent number 9,620,355
- Issue date Apr 11, 2017
- Disco Corporation
- Senichi Ryo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film detecting apparatus and protective film detecting m...
- Patent number 9,613,415
- Issue date Apr 4, 2017
- Disco Corporation
- Yu Kudo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE FILM, PROTECTIVE FILM AGENT, AND METHOD OF PROCESSING WO...
- Publication number 20240290624
- Publication date Aug 29, 2024
- Disco Corporation
- Sho OSAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20230154794
- Publication date May 18, 2023
- Disco Corporation
- Yukinobu OHURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM AGENT AND PROCESSING METHOD OF WORKPIECE
- Publication number 20230091496
- Publication date Mar 23, 2023
- Disco Corporation
- Sho OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM SUBSTANCE FOR LASER PROCESSING AND METHOD OF PROCES...
- Publication number 20220392805
- Publication date Dec 8, 2022
- Disco Corporation
- Senichi RYO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROTECTIVE FILM AGENT FOR LASER DICING
- Publication number 20220139754
- Publication date May 5, 2022
- Disco Corporation
- Senichi RYO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE FILM AGENT FOR LASER DICING
- Publication number 20200234994
- Publication date Jul 23, 2020
- Disco Corporation
- Senichi RYO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20190109173
- Publication date Apr 11, 2019
- Disco Corporation
- Ryugo OBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM FORMING RESIN AGENT AND LASER PROCESSING METHOD
- Publication number 20180134905
- Publication date May 17, 2018
- Disco Corporation
- Yukinobu Ohura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROTECTIVE FILM APPLYING APPARATUS AND PROTECTIVE FILM APPLYING METHOD
- Publication number 20170368636
- Publication date Dec 28, 2017
- Disco Corporation
- Senichi Ryo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PROTECTIVE FILM DETECTING METHOD FOR LASER PROCESSING
- Publication number 20170176331
- Publication date Jun 22, 2017
- Disco Corporation
- Senichi Ryo
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170032985
- Publication date Feb 2, 2017
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20170033007
- Publication date Feb 2, 2017
- Disco Corporation
- Yukinobu Ohura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170025269
- Publication date Jan 26, 2017
- Disco Corporation
- Senichi Ryo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIVIDING WAFER
- Publication number 20160307851
- Publication date Oct 20, 2016
- Disco Corporation
- Yukinobu Ohura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM DETECTING METHOD
- Publication number 20160266037
- Publication date Sep 15, 2016
- Disco Corporation
- Senichi Ryo
- G01 - MEASURING TESTING
Information Patent Application
PROTECTIVE FILM DETECTING APPARATUS AND PROTECTIVE FILM DETECTING M...
- Publication number 20160125591
- Publication date May 5, 2016
- Disco Corporation
- Yu Kudo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20140206177
- Publication date Jul 24, 2014
- Disco Corporation
- Yuki Ogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT
- Publication number 20140175070
- Publication date Jun 26, 2014
- Disco Corporation
- Yukinobu Ohura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABLATION METHOD
- Publication number 20130087947
- Publication date Apr 11, 2013
- Disco Corporation
- Nobuyasu KITAHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Yukinobu Ohura

Person

Patents Grantslast 30 patents

Method of manufacturing protective film agent

Protective film agent for laser dicing

Protective film forming resin agent and laser processing method

Method of processing wafer

Protective film applying apparatus and protective film applying method

Protective film detecting method

Laser processing method

Wafer processing method

Protective film detecting method for laser processing

Wafer processing method

Protective film detecting apparatus and protective film detecting m...

Patents Applicationslast 30 patents

PROTECTIVE FILM, PROTECTIVE FILM AGENT, AND METHOD OF PROCESSING WO...

METHOD OF PROCESSING WAFER

PROTECTIVE FILM AGENT AND PROCESSING METHOD OF WORKPIECE

PROTECTIVE FILM SUBSTANCE FOR LASER PROCESSING AND METHOD OF PROCES...

PROTECTIVE FILM AGENT FOR LASER DICING

PROTECTIVE FILM AGENT FOR LASER DICING

METHOD OF PROCESSING WAFER

PROTECTIVE FILM FORMING RESIN AGENT AND LASER PROCESSING METHOD

PROTECTIVE FILM APPLYING APPARATUS AND PROTECTIVE FILM APPLYING METHOD

PROTECTIVE FILM DETECTING METHOD FOR LASER PROCESSING

WAFER PROCESSING METHOD

LASER PROCESSING METHOD

WAFER PROCESSING METHOD

METHOD OF DIVIDING WAFER

PROTECTIVE FILM DETECTING METHOD

PROTECTIVE FILM DETECTING APPARATUS AND PROTECTIVE FILM DETECTING M...

WAFER PROCESSING METHOD

LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT

ABLATION METHOD