Yukio Fukunaga

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for surface treatment of substrate, and substr...
- Patent number 8,205,625
- Issue date Jun 26, 2012
- Ebara Corporation
- Hideki Tateishi
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for forming metal film
- Patent number 7,498,261
- Issue date Mar 3, 2009
- Ebara Corporation
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnects forming method and interconnects forming apparatus
- Patent number 7,374,584
- Issue date May 20, 2008
- Ebara Corporation
- Xinming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing substrate
- Patent number 7,285,492
- Issue date Oct 23, 2007
- Ebara Corporation
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnects forming method and interconnects forming apparatus
- Patent number 7,217,653
- Issue date May 15, 2007
- Ebara Corporation
- Xinming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positive displacement type liquid-delivery apparatus
- Patent number 6,419,462
- Issue date Jul 16, 2002
- Ebara Corporation
- Kuniaki Horie
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 6,387,182
- Issue date May 14, 2002
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin-film deposition apparatus
- Patent number 6,176,929
- Issue date Jan 23, 2001
- Ebara Corporation
- Yukio Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid material vaporizer apparatus and gas ejection device
- Patent number 6,036,783
- Issue date Mar 14, 2000
- Ebara Corporation
- Yukio Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thin-film vapor deposition apparatus
- Patent number 6,022,413
- Issue date Feb 8, 2000
- Ebara Corporation
- Hiroyuki Shinozaki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Vapor feed supply system
- Patent number 5,950,646
- Issue date Sep 14, 1999
- Ebara Corporation
- Kuniaki Horie
- B08 - CLEANING
Information Patent Grant
Reactant gas ejector head
- Patent number 5,950,925
- Issue date Sep 14, 1999
- Ebara Corporation
- Yukio Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vaporizer apparatus
- Patent number 5,862,605
- Issue date Jan 26, 1999
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reactant gas ejector head and thin-film vapor deposition apparatus
- Patent number 5,728,223
- Issue date Mar 17, 1998
- Ebara Corporation
- Takeshi Murakami
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20100105154
- Publication date Apr 29, 2010
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Film Thickness Measuring Method and Substrate Processing Apparatus
- Publication number 20100097607
- Publication date Apr 22, 2010
- Akira Susaki
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and method for surface treatment of substrate, and substr...
- Publication number 20080124932
- Publication date May 29, 2008
- Hideki Tateishi
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for processing substrate
- Publication number 20080000776
- Publication date Jan 3, 2008
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Substrate Processing Apparatus
- Publication number 20070289604
- Publication date Dec 20, 2007
- Yukio Fukunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects forming method and interconnects forming apparatus
- Publication number 20070228569
- Publication date Oct 4, 2007
- Xinming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrolytic processing apparatus
- Publication number 20070034502
- Publication date Feb 15, 2007
- Masayuki Kumekawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and method
- Publication number 20070034526
- Publication date Feb 15, 2007
- Natsuki Makino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrolytic processing method
- Publication number 20070034525
- Publication date Feb 15, 2007
- Masayuki Kumekawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20060118598
- Publication date Jun 8, 2006
- EBARA CORPORATION
- Yusuke Chikamori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for forming metal film
- Publication number 20060057839
- Publication date Mar 16, 2006
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for processing substrate
- Publication number 20050245080
- Publication date Nov 3, 2005
- Xinming Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrolytic processing apparatus and method
- Publication number 20050155865
- Publication date Jul 21, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Interconnects forming method and interconnects forming apparatus
- Publication number 20050064702
- Publication date Mar 24, 2005
- Xinming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for forming interconnects
- Publication number 20050048768
- Publication date Mar 3, 2005
- Hiroaki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating apparatus, plating method and substrate processing apparatus
- Publication number 20050023149
- Publication date Feb 3, 2005
- Tsutomu Nakada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Yukio Fukunaga

Person

Patents Grantslast 30 patents

Apparatus and method for surface treatment of substrate, and substr...

Method and apparatus for forming metal film

Interconnects forming method and interconnects forming apparatus

Method for processing substrate

Interconnects forming method and interconnects forming apparatus

Positive displacement type liquid-delivery apparatus

Apparatus and method for processing substrate

Thin-film deposition apparatus

Liquid material vaporizer apparatus and gas ejection device

Thin-film vapor deposition apparatus

Vapor feed supply system

Reactant gas ejector head

Vaporizer apparatus

Reactant gas ejector head and thin-film vapor deposition apparatus

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR PROCESSING SUBSTRATE

Film Thickness Measuring Method and Substrate Processing Apparatus

Apparatus and method for surface treatment of substrate, and substr...

Method and apparatus for processing substrate

Substrate Processing Apparatus

Interconnects forming method and interconnects forming apparatus

Electrolytic processing apparatus

Electrolytic processing apparatus and method

Electrolytic processing method

Bonding apparatus and bonding method

Method and apparatus for forming metal film

Method and apparatus for processing substrate

Electrolytic processing apparatus and method

Interconnects forming method and interconnects forming apparatus

Apparatus and method for forming interconnects

Plating apparatus, plating method and substrate processing apparatus