Yukio Hosaka

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Production process for electrode material, electrode and electric s...
- Patent number 9,543,079
- Issue date Jan 10, 2017
- JSR Corporation
- Ryo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imprinter including an elastic member for elastically supporting th...
- Patent number 9,193,200
- Issue date Nov 24, 2015
- Janome Sewing Machine Co., Ltd
- Yukio Hosaka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Chemical-mechanical polishing pad and chemical-mechanical polishing...
- Patent number 8,944,888
- Issue date Feb 3, 2015
- JSR Corporation
- Kotaro Kubo
- B24 - GRINDING POLISHING
Information Patent Grant
Imprinter including a roller with an elastic member being radially...
- Patent number 8,479,649
- Issue date Jul 9, 2013
- Janome Sewing Machine Co., Ltd
- Yukio Hosaka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Composition for forming polishing layer of chemical mechanical poli...
- Patent number 8,388,799
- Issue date Mar 5, 2013
- JSR Corporation
- Rikimaru Kuwabara
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing chemical mechanical polishing pad
- Patent number 7,790,788
- Issue date Sep 7, 2010
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing chemical mechanical polishing pad
- Patent number 7,329,174
- Issue date Feb 12, 2008
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for semiconductor wafer, polishing multilayered body...
- Patent number 7,323,415
- Issue date Jan 29, 2008
- JSR Corporation
- Hiroshi Shiho
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing body
- Patent number 7,217,305
- Issue date May 15, 2007
- JSR Corporation
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing body
- Patent number 7,201,641
- Issue date Apr 10, 2007
- JSR Corporation
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad and chemical mechanical polishing...
- Patent number 7,183,213
- Issue date Feb 27, 2007
- JSR Corporation
- Hiroshi Shiho
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive material
- Patent number 7,001,252
- Issue date Feb 21, 2006
- JSR Corporation
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad
- Patent number 6,976,910
- Issue date Dec 20, 2005
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for semiconductor wafer and polishing process using t...
- Patent number 6,848,974
- Issue date Feb 1, 2005
- JSR Corporation
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Thermoplastic resin composition having excellent long-term heat-agi...
- Patent number 6,337,371
- Issue date Jan 8, 2002
- Techno Polymer Co., Ltd.
- Takashi Kurata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermoplastic resin composition having excellent long-term heat-agi...
- Patent number 6,262,173
- Issue date Jul 17, 2001
- Techno Polymer Co., Ltd.
- Takashi Kurata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for packaging article with film
- Patent number 4,914,892
- Issue date Apr 10, 1990
- Kabushiki Kaisha Fuji Seisakusho
- Tsutomu Saito
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRODE MATERIAL, ELECTRODE AND ELECTRICAL STORAGE DEVICE
- Publication number 20160060125
- Publication date Mar 3, 2016
- JSR Corporation
- Kang Ko CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION PROCESS FOR ELECTRODE MATERIAL, ELECTRODE AND ELECTRIC S...
- Publication number 20150048273
- Publication date Feb 19, 2015
- JSR Corporation
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL-MECHANICAL POLISHING PAD AND CHEMICAL-MECHANICAL POLISHING...
- Publication number 20130189907
- Publication date Jul 25, 2013
- JSR Corporation
- Kotaro Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imprinter
- Publication number 20100229739
- Publication date Sep 16, 2010
- Janome Sewing Machine Co., Ltd
- Yukio Hosaka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
COMPOSITION FOR FORMING POLISHING LAYER OF CHEMICAL MECHANICAL POLI...
- Publication number 20090191795
- Publication date Jul 30, 2009
- JSR Corporation
- Rikimaru KUWABARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20090104856
- Publication date Apr 23, 2009
- JSR Corporation
- Yukio HOSAKA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD AND METHOD FOR MANUFACTURING SAME
- Publication number 20090053983
- Publication date Feb 26, 2009
- JSR CORPORATION
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Application
Imprinter
- Publication number 20080134910
- Publication date Jun 12, 2008
- Janome Sewing Machine Co., Ltd
- Yukio Hosaka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of manufacturing chemical mechanical polishing pad
- Publication number 20070082587
- Publication date Apr 12, 2007
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad for semiconductor wafer and laminated body for polish...
- Publication number 20060128271
- Publication date Jun 15, 2006
- JSR Corporation
- Hiroshi Shiho
- B24 - GRINDING POLISHING
Information Patent Application
Polishing body
- Publication number 20060116054
- Publication date Jun 1, 2006
- JSR Corporation
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Application
Polishing body
- Publication number 20060075686
- Publication date Apr 13, 2006
- JSR Corporation
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing pad and chemical mechanical polishing...
- Publication number 20050260929
- Publication date Nov 24, 2005
- JSR Corporation
- Hiroshi Shiho
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing pad, manufacturing process thereof an...
- Publication number 20050245171
- Publication date Nov 3, 2005
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing pad, manufacturing process thereof an...
- Publication number 20050239380
- Publication date Oct 27, 2005
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing pad and chemical mechanical polishing...
- Publication number 20050014376
- Publication date Jan 20, 2005
- JSR Corporation
- Hiroshi Shiho
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad
- Publication number 20050003749
- Publication date Jan 6, 2005
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Application
Abrasive pad, method and metal mold for manufacturing the same, and...
- Publication number 20040203320
- Publication date Oct 14, 2004
- JSR Corporation
- Yukio Hosaka
- B24 - GRINDING POLISHING
Information Patent Application
Composition for polishing pad and polishing pad therewith
- Publication number 20040063391
- Publication date Apr 1, 2004
- JSR Corporation
- Yukio Hosaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polishing pad and multi-layer polishing pad
- Publication number 20040014413
- Publication date Jan 22, 2004
- JSR Corporation
- Nobuo Kawahashi
- B24 - GRINDING POLISHING
Information Patent Application
Abrasive material
- Publication number 20030153255
- Publication date Aug 14, 2003
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad for semiconductor wafer and polishing process using t...
- Publication number 20030060138
- Publication date Mar 27, 2003
- JSR Corporation
- Kou Hasegawa
- B24 - GRINDING POLISHING
Information Patent Application
Thermoplastic resin composition having excellent long-term heat-agi...
- Publication number 20010011116
- Publication date Aug 2, 2001
- Techno Polymer Co., Ltd.
- Takashi Kurata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yukio Hosaka

Person

Patents Grantslast 30 patents

Production process for electrode material, electrode and electric s...

Imprinter including an elastic member for elastically supporting th...

Chemical-mechanical polishing pad and chemical-mechanical polishing...

Imprinter including a roller with an elastic member being radially...

Composition for forming polishing layer of chemical mechanical poli...

Method for producing chemical mechanical polishing pad

Method of manufacturing chemical mechanical polishing pad

Polishing pad for semiconductor wafer, polishing multilayered body...

Polishing body

Polishing body

Chemical mechanical polishing pad and chemical mechanical polishing...

Abrasive material

Polishing pad

Polishing pad for semiconductor wafer and polishing process using t...

Thermoplastic resin composition having excellent long-term heat-agi...

Thermoplastic resin composition having excellent long-term heat-agi...

Process for packaging article with film

Patents Applicationslast 30 patents

ELECTRODE MATERIAL, ELECTRODE AND ELECTRICAL STORAGE DEVICE

PRODUCTION PROCESS FOR ELECTRODE MATERIAL, ELECTRODE AND ELECTRIC S...

CHEMICAL-MECHANICAL POLISHING PAD AND CHEMICAL-MECHANICAL POLISHING...

Imprinter

COMPOSITION FOR FORMING POLISHING LAYER OF CHEMICAL MECHANICAL POLI...

METHOD FOR PRODUCING CHEMICAL MECHANICAL POLISHING PAD

CHEMICAL MECHANICAL POLISHING PAD AND METHOD FOR MANUFACTURING SAME

Imprinter

Method of manufacturing chemical mechanical polishing pad

Polishing pad for semiconductor wafer and laminated body for polish...

Polishing body

Polishing body

Chemical mechanical polishing pad and chemical mechanical polishing...

Chemical mechanical polishing pad, manufacturing process thereof an...

Chemical mechanical polishing pad, manufacturing process thereof an...

Chemical mechanical polishing pad and chemical mechanical polishing...

Polishing pad

Abrasive pad, method and metal mold for manufacturing the same, and...

Composition for polishing pad and polishing pad therewith

Polishing pad and multi-layer polishing pad

Abrasive material

Polishing pad for semiconductor wafer and polishing process using t...

Thermoplastic resin composition having excellent long-term heat-agi...