Yukio KANEDA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 12,125,858
- Issue date Oct 22, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion element, method of manufacturing the same,...
- Patent number 12,114,516
- Issue date Oct 8, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device having charge storage electrode, first electrode, se...
- Patent number 12,027,565
- Issue date Jul 2, 2024
- Sony Group Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and solid-state imaging device
- Patent number 11,910,624
- Issue date Feb 20, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shintarou Hirata
Information Patent Grant
Imaging element and imaging apparatus
- Patent number 11,825,666
- Issue date Nov 21, 2023
- Sony Corporation
- Yosuke Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and solid-state image sensor
- Patent number 11,793,009
- Issue date Oct 17, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion element, measuring method of the same, sol...
- Patent number 11,711,931
- Issue date Jul 25, 2023
- Sony Group Corporation
- Yukio Kaneda
- G01 - MEASURING TESTING
Information Patent Grant
Imaging device and solid-state image sensor
- Patent number 11,563,058
- Issue date Jan 24, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and solid-state imaging device
- Patent number 11,552,268
- Issue date Jan 10, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shintarou Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and solid-state image sensor
- Patent number 11,532,672
- Issue date Dec 20, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device having a plurality of electrodes with a photoelectri...
- Patent number 11,348,965
- Issue date May 31, 2022
- Sony Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, stacked imaging element, and solid-state imaging a...
- Patent number 11,276,726
- Issue date Mar 15, 2022
- Sony Corporation
- Toshiki Moriwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion element, Method of manufacturing the same,...
- Patent number 11,264,580
- Issue date Mar 1, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image sensor for phase difference detection, method of...
- Patent number 11,217,620
- Issue date Jan 4, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image sensor for phase difference detection, method of...
- Patent number 11,183,530
- Issue date Nov 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion element, measuring method of the same, sol...
- Patent number 11,127,909
- Issue date Sep 21, 2021
- Sony Corporation
- Yukio Kaneda
- G01 - MEASURING TESTING
Information Patent Grant
Imaging element, laminated imaging element, and solid-state imaging...
- Patent number 11,101,303
- Issue date Aug 24, 2021
- Sony Corporation
- Hideki Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device having first, second and third electrodes with an in...
- Patent number 10,714,532
- Issue date Jul 14, 2020
- Sony Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, stacked-type imaging element, solid-state imaging...
- Patent number 10,468,451
- Issue date Nov 5, 2019
- Sony Corporation
- Hideaki Togashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Solid-state image sensor with separated electrode, method of manufa...
- Patent number 10,453,890
- Issue date Oct 22, 2019
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yukio Kaneda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
IMAGING ELEMENT AND IMAGING APPARATUS
- Publication number 20240023352
- Publication date Jan 18, 2024
- SONY GROUP CORPORATION
- Yosuke SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND SOLID-STATE IMAGE SENSOR
- Publication number 20230422534
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yukio KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, MEASURING METHOD OF THE SAME, SOL...
- Publication number 20230329016
- Publication date Oct 12, 2023
- SONY GROUP CORPORATION
- YUKIO KANEDA
- G01 - MEASURING TESTING
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING DEVICE
- Publication number 20230119970
- Publication date Apr 20, 2023
- Sony Semiconductor Solutions Corporation
- Shintarou HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND SOLID-STATE IMAGE SENSOR
- Publication number 20230068319
- Publication date Mar 2, 2023
- Sony Semiconductor Solutions Corporation
- Yukio KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20220392931
- Publication date Dec 8, 2022
- Sony Semiconductor Solutions Corporation
- YUKIO KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...
- Publication number 20220336521
- Publication date Oct 20, 2022
- SONY GROUP CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20220149304
- Publication date May 12, 2022
- Sony Semiconductor Solutions Corporation
- YUKIO KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELE...
- Publication number 20220059592
- Publication date Feb 24, 2022
- Sony Semiconductor Solutions Corporation
- Yukio KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, MEASURING METHOD OF THE SAME, SOL...
- Publication number 20220045292
- Publication date Feb 10, 2022
- SONY GROUP CORPORATION
- YUKIO KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMA...
- Publication number 20220020819
- Publication date Jan 20, 2022
- Sony Semiconductor Solutions Corporation
- YUKIO KANEDA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
IMAGING ELEMENT AND IMAGING APPARATUS
- Publication number 20210265428
- Publication date Aug 26, 2021
- SONY CORPORATION
- Yosuke SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND SOLID-STATE IMAGE SENSOR
- Publication number 20210257415
- Publication date Aug 19, 2021
- Sony Semiconductor Solutions Corporation
- Yukio KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING DEVICE
- Publication number 20210020857
- Publication date Jan 21, 2021
- Sony Semiconductor Solutions Corporation
- Shintarou HIRATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...
- Publication number 20200303449
- Publication date Sep 24, 2020
- SONY CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...
- Publication number 20200295219
- Publication date Sep 17, 2020
- SONY CORPORATION
- Toshiki MORIWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, MEASURING METHOD OF THE SAME, SOL...
- Publication number 20200295285
- Publication date Sep 17, 2020
- SONY CORPORATION
- YUKIO KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...
- Publication number 20200258923
- Publication date Aug 13, 2020
- SONY CORPORATION
- Hideki ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING A...
- Publication number 20200119078
- Publication date Apr 16, 2020
- SONY CORPORATION
- Toshiki MORIWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELE...
- Publication number 20200083276
- Publication date Mar 12, 2020
- Sony Semiconductor Solutions Corporation
- Yukio KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION ELEMENT, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20180323390
- Publication date Nov 8, 2018
- Sony Semiconductor Solutions Corporation
- Yukio KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...
- Publication number 20180175102
- Publication date Jun 21, 2018
- SONY CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...
- Publication number 20180076252
- Publication date Mar 15, 2018
- SONY CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELE...
- Publication number 20170243912
- Publication date Aug 24, 2017
- Sony Semiconductor Solutions Corporation
- Yukio KANEDA
- H01 - BASIC ELECTRIC ELEMENTS

Yukio KANEDA

Person

Patents Grantslast 30 patents

Solid-state imaging device and electronic apparatus

Photoelectric conversion element, method of manufacturing the same,...

Imaging device having charge storage electrode, first electrode, se...

Solid-state imaging element and solid-state imaging device

Imaging element and imaging apparatus

Imaging device and solid-state image sensor

Photoelectric conversion element, measuring method of the same, sol...

Imaging device and solid-state image sensor

Solid-state imaging element and solid-state imaging device

Imaging device and solid-state image sensor

Imaging device having a plurality of electrodes with a photoelectri...

Imaging element, stacked imaging element, and solid-state imaging a...

Photoelectric conversion element, Method of manufacturing the same,...

Solid-state image sensor for phase difference detection, method of...

Solid-state image sensor for phase difference detection, method of...

Photoelectric conversion element, measuring method of the same, sol...

Imaging element, laminated imaging element, and solid-state imaging...

Imaging device having first, second and third electrodes with an in...

Imaging element, stacked-type imaging element, solid-state imaging...

Solid-state image sensor with separated electrode, method of manufa...

Patents Applicationslast 30 patents

IMAGING ELEMENT AND IMAGING APPARATUS

IMAGING DEVICE AND SOLID-STATE IMAGE SENSOR

PHOTOELECTRIC CONVERSION ELEMENT, MEASURING METHOD OF THE SAME, SOL...

SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING DEVICE

IMAGING DEVICE AND SOLID-STATE IMAGE SENSOR

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...

PHOTOELECTRIC CONVERSION ELEMENT, METHOD OF MANUFACTURING THE SAME,...

SOLID-STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELE...

PHOTOELECTRIC CONVERSION ELEMENT, MEASURING METHOD OF THE SAME, SOL...

SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMA...

IMAGING ELEMENT AND IMAGING APPARATUS

IMAGING DEVICE AND SOLID-STATE IMAGE SENSOR

SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING DEVICE

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...

IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...

PHOTOELECTRIC CONVERSION ELEMENT, MEASURING METHOD OF THE SAME, SOL...

IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, AND SOLID-STATE IMAGING...

IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING A...

SOLID-STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELE...

PHOTOELECTRIC CONVERSION ELEMENT, METHOD OF MANUFACTURING THE SAME,...

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT, SOLID-STATE IMAGING...

SOLID-STATE IMAGE SENSOR, METHOD OF MANUFACTURING THE SAME, AND ELE...