Yukio Maeda

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flow soldering process and apparatus
- Patent number 6,805,282
- Issue date Oct 19, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuji Kawashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and electronic circuit board
- Patent number 6,657,135
- Issue date Dec 2, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for estimating quality of lead-free solder mat...
- Patent number 6,607,116
- Issue date Aug 19, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic parts on a printed circuit board by...
- Patent number 5,427,642
- Issue date Jun 27, 1995
- Matsushita Electric Industrial Co., Ltd.
- Takashi Akiguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Image reading device having a light waveguide means widened toward...
- Patent number 5,198,655
- Issue date Mar 30, 1993
- Matsushita Electric Industrial Co., Ltd.
- Kenichiro Suetsugu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for packaging electronic parts and adhesive for use in said...
- Patent number 5,137,936
- Issue date Aug 11, 1992
- Matsushita Electric Industrial Co., Ltd.
- Takashi Akiguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Image sensor having light guides for communication with image plane
- Patent number 5,136,150
- Issue date Aug 4, 1992
- Matsushita Electric Industrial Co., Ltd.
- Tetsuo Fukushima
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for mounting electronic parts
- Patent number 4,880,486
- Issue date Nov 14, 1989
- Matsushita Electric Industrial Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming thick film circuit using rotatable nozzle having...
- Patent number 4,720,914
- Issue date Jan 26, 1988
- Matsushita Electric Industrial Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for drawing a thick film circuit
- Patent number 4,692,351
- Issue date Sep 8, 1987
- Matsushita Electric Industrial Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method of semiconductor device
- Patent number 4,676,864
- Issue date Jun 30, 1987
- Matsushita Electric Industrial Co., Ltd.
- Yukio Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming thick film circuits
- Patent number 4,664,945
- Issue date May 12, 1987
- Matsushita Electric Industrial Co., Ltd.
- Yukio Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an optical recording/reproducing disc
- Patent number 4,546,464
- Issue date Oct 8, 1985
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- G11 - INFORMATION STORAGE
Information Patent Grant
Disc coating method
- Patent number 4,452,819
- Issue date Jun 5, 1984
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- G11 - INFORMATION STORAGE
Information Patent Grant
Alkaline galvanic cell
- Patent number 4,407,914
- Issue date Oct 4, 1983
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating compositions and resin moldings using same
- Patent number 4,397,723
- Issue date Aug 9, 1983
- Matsushita Electric Industrial Co., Ltd.
- Takao Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Bonded structure and electronic circuit board
- Publication number 20020187689
- Publication date Dec 12, 2002
- Kenichiro Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux applying method, flow soldering method and devices therefor an...
- Publication number 20020179690
- Publication date Dec 5, 2002
- Yasuji Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for flow soldering
- Publication number 20020179693
- Publication date Dec 5, 2002
- Yasuji Kawashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for estimating quality of lead-free solder mat...
- Publication number 20020000460
- Publication date Jan 3, 2002
- Kenichiro Suetsugu
- G01 - MEASURING TESTING

Yukio Maeda

Person

Patents Grantslast 30 patents

Flow soldering process and apparatus

Connection structure and electronic circuit board

Method and apparatus for estimating quality of lead-free solder mat...

Method for mounting electronic parts on a printed circuit board by...

Image reading device having a light waveguide means widened toward...

Method for packaging electronic parts and adhesive for use in said...

Image sensor having light guides for communication with image plane

Method for mounting electronic parts

Method for forming thick film circuit using rotatable nozzle having...

Method and apparatus for drawing a thick film circuit

Bonding method of semiconductor device

Method of forming thick film circuits

Method of manufacturing an optical recording/reproducing disc

Disc coating method

Alkaline galvanic cell

Coating compositions and resin moldings using same

Patents Applicationslast 30 patents

Bonded structure and electronic circuit board

Flux applying method, flow soldering method and devices therefor an...

Method and device for flow soldering

Method and apparatus for estimating quality of lead-free solder mat...