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Yukio Maeda
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Yokohama, JP
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last 30 patents
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Patent Grant
Multi-layer wiring substrate and manufacturing method thereof
Patent number
6,506,982
Issue date
Jan 14, 2003
Hitachi, Ltd.
Hidetaka Shigi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Multi-layer wiring substrate and manufacturing method thereof
Publication number
20030019663
Publication date
Jan 30, 2003
Hidetaka Shigi
H01 - BASIC ELECTRIC ELEMENTS