Yukio MARUTA

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Kasugai-shi, Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and device for cutting wire formed on semiconductor substrate
- Patent number 7,037,732
- Issue date May 2, 2006
- Fujitsu Limited
- Yukio Maruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND DEVICE FOR CUTTING WIRE FORMED ON SEMICONDUCTOR SUBSTRATE
- Publication number 20050085088
- Publication date Apr 21, 2005
- FUJITSU LIMITED
- Yukio MARUTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR