Yukio Nakajima

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Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer thinning method, and thin semiconductor wafer
- Patent number 6,930,023
- Issue date Aug 16, 2005
- Shin-Etsu Handotai Co, Ltd.
- Mamoru Okada
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor wafer thinning method, and thin semiconductor wafer
- Publication number 20030113984
- Publication date Jun 19, 2003
- Mamoru Okada
- B24 - GRINDING POLISHING