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Ryuou, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Die bonder and bonding method
Patent number
10,096,526
Issue date
Oct 9, 2018
FASFORD TECHNOLOGY CO., LTD.
Masayuki Mochizuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die bonder and bonding method
Patent number
8,991,681
Issue date
Mar 31, 2015
Hitachi High-Tech Instuments Co., Ltd.
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
8,640,943
Issue date
Feb 4, 2014
Renesas Electronics Corporation
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
8,292,159
Issue date
Oct 23, 2012
Renesas Eletronics Corporation
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
8,074,868
Issue date
Dec 13, 2011
Renesas Electronics Corporation
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,861,912
Issue date
Jan 4, 2011
Renesas Electronics Corporation
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,757,930
Issue date
Jul 20, 2010
Renesas Technology Corp.
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabrication of semiconductor integrated circuit device
Patent number
7,270,258
Issue date
Sep 18, 2007
Renesas Technology Corp.
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Die Bonder and Bonding Method
Publication number
20130068824
Publication date
Mar 21, 2013
Hitachi High-Tech Instruments Co., Ltd.
Masayuki MOCHIZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Bonder and Bonding Method
Publication number
20130068823
Publication date
Mar 21, 2013
Hitachi High-Tech Instruments Co., Ltd.
Hiroshi MAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Bonder and Bonding Method
Publication number
20130068826
Publication date
Mar 21, 2013
Hitachi High-Tech Instruments Co., Ltd.
Hiroshi MAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20120329211
Publication date
Dec 27, 2012
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20120058603
Publication date
Mar 8, 2012
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20110070696
Publication date
Mar 24, 2011
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20100279464
Publication date
Nov 4, 2010
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20070287262
Publication date
Dec 13, 2007
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20050061856
Publication date
Mar 24, 2005
Hiroshi Maki
H01 - BASIC ELECTRIC ELEMENTS