Yukio Yamada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Joined structure and method for producing the same
- Patent number 8,330,052
- Issue date Dec 11, 2012
- Sony Chemical & Information Device Corporation
- Tomoyuki Ishimatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumpless semiconductor device
- Patent number 7,638,876
- Issue date Dec 29, 2009
- Sony Chemical & Information Device Corporation
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-shaped adhesive application apparatus
- Patent number 7,459,046
- Issue date Dec 2, 2008
- Sony Corporation
- Hiroyuki Kumakura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Conductive particle and adhesive agent
- Patent number 7,413,686
- Issue date Aug 19, 2008
- Sony Chemicals Corporation
- Yukio Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup apparatus
- Patent number 7,161,749
- Issue date Jan 9, 2007
- Sony Corporation
- Nobumasa Sakurai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bumpless semiconductor device
- Patent number 7,109,058
- Issue date Sep 19, 2006
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for mounting semiconductor device and mounting apparatus
- Patent number 6,769,469
- Issue date Aug 3, 2004
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release films and adhesive films using the release films
- Patent number 6,762,504
- Issue date Jul 13, 2004
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particle material anisotropic conductive connection and anisotropic...
- Patent number 6,632,532
- Issue date Oct 14, 2003
- Sony Chemicals Corp.
- Yukio Yamada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for mounting electronic elements
- Patent number 6,531,026
- Issue date Mar 11, 2003
- Sony Chemicals Corp.
- Motohide Takeichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropically electroconductive connection body and method for fo...
- Patent number 6,512,184
- Issue date Jan 28, 2003
- Sony Chemicals Corporation
- Yukio Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for mounting semiconductor device
- Patent number 6,409,866
- Issue date Jun 25, 2002
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method
- Patent number 6,349,872
- Issue date Feb 26, 2002
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive adhesive film
- Patent number 6,344,156
- Issue date Feb 5, 2002
- Sony Chemicals Corporation
- Yukio Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for mounting semiconductor device and mounting apparatus
- Patent number 6,340,607
- Issue date Jan 22, 2002
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PTC-element, protective device and electric circuit board
- Patent number 6,114,672
- Issue date Sep 5, 2000
- Sony Corporation
- Norikazu Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Case for a video camera
- Patent number D423212
- Issue date Apr 25, 2000
- Sony Corporation
- Nobumasa Sakurai
- D03 - Travel goods and personal belongings
Information Patent Grant
Multilayer anisotropic electroconductive adhesive and method for ma...
- Patent number 6,020,059
- Issue date Feb 1, 2000
- Sony Chemicals Corporation
- Yukio Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropically electroconductive adhesive and adhesive film
- Patent number 5,965,064
- Issue date Oct 12, 1999
- Sony Chemicals Corporation
- Yukio Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermocompression bonding equipment
- Patent number 5,698,068
- Issue date Dec 16, 1997
- Sony Corporation
- Iwao Ichikawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermocompression bonding apparatus, thermocompression bonding meth...
- Patent number 5,439,161
- Issue date Aug 8, 1995
- Sony Corporation
- Norio Kawatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Video camera modular accessory apparatus
- Patent number 5,189,520
- Issue date Feb 23, 1993
- Sony Corporation
- Yoshisada Okayasu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Video light apparatus turned-on selectively in a standby-mode of a...
- Patent number 5,073,823
- Issue date Dec 17, 1991
- Sony Corporation
- Yukio Yamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Superconducting wire containing multifilamentary superconducting alloy
- Patent number 4,959,279
- Issue date Sep 25, 1990
- The Furukawa Electric Co., Ltd.
- Yasuzo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Joined Structure and Method for Producing the Same
- Publication number 20120055703
- Publication date Mar 8, 2012
- Tomoyuki Ishimatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM-SHAPED ADHESIVE APPLICATION APPARATUS
- Publication number 20070102105
- Publication date May 10, 2007
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Hiroyuki Kumakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bumpless semiconductor device
- Publication number 20060249856
- Publication date Nov 9, 2006
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive particle and adhesive agent
- Publication number 20060054867
- Publication date Mar 16, 2006
- Yukio Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Imaging device
- Publication number 20060007551
- Publication date Jan 12, 2006
- Nobumasa Sakurai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Conversion lens system
- Publication number 20050168830
- Publication date Aug 4, 2005
- SONY CORPORATION
- Yoshio Segawa
- G02 - OPTICS
Information Patent Application
Bumpless semiconductor device
- Publication number 20040217460
- Publication date Nov 4, 2004
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Film-shaped adhesive application apparatus
- Publication number 20030178147
- Publication date Sep 25, 2003
- Sony Chemicals Corp.
- Hiroyuki Kumakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive for connecting electrodes and adhesion methods with the us...
- Publication number 20030029559
- Publication date Feb 13, 2003
- SONY CHEMICAL CORP.
- Yukio Yamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for mounting semiconductor device and mounting apparatus
- Publication number 20020029857
- Publication date Mar 14, 2002
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FILM
- Publication number 20020014615
- Publication date Feb 7, 2002
- YUKIO YAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Yukio Yamada

Person

Patents Grantslast 30 patents

Joined structure and method for producing the same

Bumpless semiconductor device

Film-shaped adhesive application apparatus

Conductive particle and adhesive agent

Image pickup apparatus

Bumpless semiconductor device

Process for mounting semiconductor device and mounting apparatus

Release films and adhesive films using the release films

Particle material anisotropic conductive connection and anisotropic...

Method for mounting electronic elements

Anisotropically electroconductive connection body and method for fo...

Process for mounting semiconductor device

Packaging method

Anisotropic conductive adhesive film

Process for mounting semiconductor device and mounting apparatus

PTC-element, protective device and electric circuit board

Case for a video camera

Multilayer anisotropic electroconductive adhesive and method for ma...

Anisotropically electroconductive adhesive and adhesive film

Thermocompression bonding equipment

Thermocompression bonding apparatus, thermocompression bonding meth...

Video camera modular accessory apparatus

Video light apparatus turned-on selectively in a standby-mode of a...

Superconducting wire containing multifilamentary superconducting alloy

Patents Applicationslast 30 patents

Joined Structure and Method for Producing the Same

FILM-SHAPED ADHESIVE APPLICATION APPARATUS

Bumpless semiconductor device

Conductive particle and adhesive agent

Imaging device

Conversion lens system

Bumpless semiconductor device

Film-shaped adhesive application apparatus

Adhesive for connecting electrodes and adhesion methods with the us...

Process for mounting semiconductor device and mounting apparatus

ANISOTROPIC CONDUCTIVE ADHESIVE FILM