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Yukio Yamaguchi
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Otsu, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing a resin-sealed semiconductor device
Patent number
6,642,082
Issue date
Nov 4, 2003
Matsushita Electric Industrial Co., Ltd.
Yukio Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame, resin-molded semiconductor device, and method for manuf...
Patent number
6,455,348
Issue date
Sep 24, 2002
Matsushita Electric Industrial Co., Ltd.
Yukio Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin molded semiconductor device and method for manufacturing the...
Patent number
6,291,274
Issue date
Sep 18, 2001
Matsushita Electric Industrial Co., Ltd.
Seishi Oida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing resin-molded semiconductor device
Patent number
6,258,314
Issue date
Jul 10, 2001
Matsushita Electronics Corporation
Seishi Oida
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Lead frame, method of manufacturing lead frame, semiconductor devic...
Patent number
6,225,146
Issue date
May 1, 2001
Matsushita Electronics Corporation
Yukio Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame, method for manufacturing the frame, resin-molded semico...
Patent number
6,166,430
Issue date
Dec 26, 2000
Matsushita Electronics Corporation
Yukio Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing resin-molded semiconductor device
Patent number
6,126,885
Issue date
Oct 3, 2000
Matsushita Electronics Corporation
Seishi Oida
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Resin encapsulated semiconductor device having a reduced thickness...
Patent number
6,081,029
Issue date
Jun 27, 2000
Matsushita Electronics Corporation
Yukio Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame, method of manufacturing lead frame, semiconductor devic...
Patent number
5,977,615
Issue date
Nov 2, 1999
Matsushita Electronics Corporation
Yukio Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and method of manufacturing the same, and resin sealed s...
Patent number
5,708,295
Issue date
Jan 13, 1998
Matsushita Electronics Corporation
Akira Oga
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for manufacturing a resin-sealed semiconductor device
Publication number
20030003627
Publication date
Jan 2, 2003
Yukio Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Resin-molded semiconductor device and method for manufacturing the...
Publication number
20010045640
Publication date
Nov 29, 2001
Seishi Oida
H01 - BASIC ELECTRIC ELEMENTS