Yukitaka Sonoda

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Higashiyamato, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting apparatus and the same method thereof
- Patent number 9,398,736
- Issue date Jul 19, 2016
- Shinkawa Ltd.
- Satoru Nagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping mechanism for a bonding apparatus
- Patent number 5,826,778
- Issue date Oct 27, 1998
- Kabushiki Kaisha Shinkawa
- Koji Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suction adhesion-type holder
- Patent number 5,306,139
- Issue date Apr 26, 1994
- Kabushiki Kaisha Shinkawa
- Kanji Ozawa
- C30 - CRYSTAL GROWTH
Information Patent Grant
Bonding method and apparatus therefor
- Patent number 5,225,026
- Issue date Jul 6, 1993
- Kabushiki Kaisha Shinkawa
- Kanji Ozawa
- G01 - MEASURING TESTING
Information Patent Grant
Bonding head assembly
- Patent number 5,190,205
- Issue date Mar 2, 1993
- Kabushiki Kaisha Shinkawa
- Kanji Ozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND THE SAME METHOD THEREOF
- Publication number 20130181037
- Publication date Jul 18, 2013
- SHINKAWA LTD.
- Satoru Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part inspection method and an electronic part assembly a...
- Publication number 20020008528
- Publication date Jan 24, 2002
- KABUSHIKI KAISHA SHINKAWA
- Koji Sato
- G01 - MEASURING TESTING