Yukitoshi Hase

Person

Mie-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer transport method and semiconductor wafer transp...
- Patent number 8,960,266
- Issue date Feb 24, 2015
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape joining method and adhesive tape joining apparatus
- Patent number 8,349,106
- Issue date Jan 8, 2013
- Nitto Denko Corporation
- Saburo Miyamoto
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for cutting protective tape of semiconductor wafer and prote...
- Patent number 8,109,185
- Issue date Feb 7, 2012
- Nitto Denko Corporation
- Masayuki Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for separating protective tape from semiconduc...
- Patent number 8,038,816
- Issue date Oct 18, 2011
- Nitto Denko Corporation
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for laminating substrate and apparatus using the method
- Patent number 7,811,899
- Issue date Oct 12, 2010
- Nitto Denko Corporation
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for joining adhesive tape
- Patent number 7,807,004
- Issue date Oct 5, 2010
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for separating semiconductor wafer from supporting member, a...
- Patent number 7,393,757
- Issue date Jul 1, 2008
- Nitto Denko Corporation
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating semiconductor wafer, and separating apparatus...
- Patent number 7,384,811
- Issue date Jun 10, 2008
- Nitto Denko Corporation
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate joining apparatus
- Patent number 7,078,316
- Issue date Jul 18, 2006
- Nitto Denko Corporation
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER APPARATUS
- Publication number 20120247657
- Publication date Oct 4, 2012
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER TRANSPORT METHOD AND SEMICONDUCTOR WAFER TRANSP...
- Publication number 20120132412
- Publication date May 31, 2012
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE TRANSPORT METHOD AND WORKPIECE TRANSPORT APPARATUS
- Publication number 20120082516
- Publication date Apr 5, 2012
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE
- Publication number 20110073241
- Publication date Mar 31, 2011
- Yukitoshi Hase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
- Publication number 20110056615
- Publication date Mar 10, 2011
- Saburo Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROTECTIVE TAPE SEPARATING METHOD AND APPARATUS
- Publication number 20110048630
- Publication date Mar 3, 2011
- Yukitoshi Hase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
- Publication number 20110048609
- Publication date Mar 3, 2011
- Saburo Miyamoto
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD AND CONFIGURATION FOR REINFORCING PLATE MATERIAL
- Publication number 20110045234
- Publication date Feb 24, 2011
- Saburo Miyamoto
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
WAFER MOUNTING METHOD AND WAFER MOUNTING APPARATUS
- Publication number 20100300612
- Publication date Dec 2, 2010
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE FROM SEMICONDUC...
- Publication number 20100147442
- Publication date Jun 17, 2010
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
CUTTER BLADE CLEANING METHOD AND CUTTER BLADE CLEANING DEVICE, AS W...
- Publication number 20090272403
- Publication date Nov 5, 2009
- Masayuki Yamamoto
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
CUTTER BLADE CLEANING METHOD AND CUTTER BLADE CLEANING DEVICE, AS W...
- Publication number 20090205679
- Publication date Aug 20, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTE...
- Publication number 20090133551
- Publication date May 28, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME
- Publication number 20090095418
- Publication date Apr 16, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING ADHESIVE TAPE AND APPARATUS USING THE METHOD
- Publication number 20080169056
- Publication date Jul 17, 2008
- NITTO DENKO CORPORATION
- Masayuki YAMAMOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR LAMINATING SUBSTRATE AND APPARATUS USING THE METHOD
- Publication number 20080138936
- Publication date Jun 12, 2008
- NITTO DENKO CORPORATION
- Masayuki YAMAMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of separating semiconductor wafer, and separating apparatus...
- Publication number 20050074952
- Publication date Apr 7, 2005
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for separating semiconductor wafer from supporting member, a...
- Publication number 20050032332
- Publication date Feb 10, 2005
- Saburo Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Substrate joining method and apparatus
- Publication number 20050014345
- Publication date Jan 20, 2005
- Saburo Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Yukitoshi Hase

Person

Patents Grantslast 30 patents

Semiconductor wafer transport method and semiconductor wafer transp...

Adhesive tape joining method and adhesive tape joining apparatus

Method for cutting protective tape of semiconductor wafer and prote...

Method and apparatus for separating protective tape from semiconduc...

Method for laminating substrate and apparatus using the method

Method for joining adhesive tape

Method for separating semiconductor wafer from supporting member, a...

Method of separating semiconductor wafer, and separating apparatus...

Substrate joining apparatus

Patents Applicationslast 30 patents

SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER APPARATUS

SEMICONDUCTOR WAFER TRANSPORT METHOD AND SEMICONDUCTOR WAFER TRANSP...

WORKPIECE TRANSPORT METHOD AND WORKPIECE TRANSPORT APPARATUS

METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE

ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS

PROTECTIVE TAPE SEPARATING METHOD AND APPARATUS

ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS

METHOD AND CONFIGURATION FOR REINFORCING PLATE MATERIAL

WAFER MOUNTING METHOD AND WAFER MOUNTING APPARATUS

METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE FROM SEMICONDUC...

CUTTER BLADE CLEANING METHOD AND CUTTER BLADE CLEANING DEVICE, AS W...

CUTTER BLADE CLEANING METHOD AND CUTTER BLADE CLEANING DEVICE, AS W...

METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTE...

ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME

METHOD FOR JOINING ADHESIVE TAPE AND APPARATUS USING THE METHOD

METHOD FOR LAMINATING SUBSTRATE AND APPARATUS USING THE METHOD

Method of separating semiconductor wafer, and separating apparatus...

Method for separating semiconductor wafer from supporting member, a...

Substrate joining method and apparatus