Yukyung Park

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 12,218,043
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,142,573
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
- Patent number 11,984,415
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,784,131
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including same
- Patent number 11,728,255
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring protection layer on an interposer with a through electrode
- Patent number 11,587,859
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 11,482,483
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with through electrode having a wiring protection layer
- Patent number 11,195,785
- Issue date Dec 7, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20240274553
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240006328
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Yukyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20230352386
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230066895
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20230052195
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...
- Publication number 20220302053
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20220051970
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20220013445
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210391269
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Yukyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20210175161
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20210167001
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS

Yukyung Park

Person

Patents Grantslast 30 patents

Interposer, semiconductor package including the same, and method of...

Interposer and semiconductor package including the same

Interposer, method for fabricating the same, and semiconductor pack...

Interposer and semiconductor package including the same

Interposer and semiconductor package including same

Wiring protection layer on an interposer with a through electrode

Interposer, semiconductor package including the same, and method of...

Interposer with through electrode having a wiring protection layer

Patents Applicationslast 30 patents

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME

INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

INTERPOSER, METHOD FOR FABRICATING THE SAME, AND SEMICONDUCTOR PACK...

INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME