Yul Kyo Chung

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a printed circuit board including an embed...
- Patent number 10,887,995
- Issue date Jan 5, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for camera module and camera module having the same
- Patent number 10,270,948
- Issue date Apr 23, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,199,329
- Issue date Feb 5, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board including embedded electronic component and m...
- Patent number 10,015,884
- Issue date Jul 3, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 9,875,970
- Issue date Jan 23, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 9,788,433
- Issue date Oct 10, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 9,788,409
- Issue date Oct 10, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young-Kwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including electronic component embedded there...
- Patent number 9,526,177
- Issue date Dec 20, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered substrate
- Patent number 9,474,167
- Issue date Oct 18, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yee Na Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate and manufacturing method th...
- Patent number 9,462,697
- Issue date Oct 4, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yul Kyo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate embedding passive element
- Patent number 9,420,683
- Issue date Aug 16, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic capacitor and printed circuit board including th...
- Patent number 9,345,141
- Issue date May 17, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having electronic component embedded therein and method o...
- Patent number 9,313,893
- Issue date Apr 12, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate and method of manufacturing the same
- Patent number 9,307,632
- Issue date Apr 5, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive device embedded in substrate and substrate with passive dev...
- Patent number 9,155,199
- Issue date Oct 6, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yee Na Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,087,837
- Issue date Jul 21, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,871,569
- Issue date Oct 28, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded printed circuit board and manufacturing method thereof
- Patent number 8,802,999
- Issue date Aug 12, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong In Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing cavity of core substrate
- Patent number 8,633,397
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics component embedded PCB
- Patent number 8,618,421
- Issue date Dec 31, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Soo Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for testing component built in the circuit...
- Patent number 8,547,132
- Issue date Oct 1, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB strip and manufacturing method for electronic component embedde...
- Patent number 8,482,890
- Issue date Jul 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Moon-il Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test method for passive device embedded printed circuit board
- Patent number 8,482,310
- Issue date Jul 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Hyun-Ho Kim
- G01 - MEASURING TESTING
Information Patent Grant
Capacitor and manufacturing method thereof
- Patent number 8,199,456
- Issue date Jun 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Sung-Taek Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package and printed circuit board
- Patent number 8,064,215
- Issue date Nov 22, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yul-Kyo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board with a thin film c...
- Patent number 8,049,117
- Issue date Nov 1, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jung Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board with a thin film c...
- Patent number 8,039,759
- Issue date Oct 18, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jung Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor, thin film capacitor-embedded printed circuit b...
- Patent number 7,943,858
- Issue date May 17, 2011
- Samsung Electro-Mechanics Co. Ltd.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating solution for forming high dielectric constant thin film and...
- Patent number 7,927,517
- Issue date Apr 19, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jun Hee Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating solution for forming high dielectric constant thin film and...
- Patent number 7,887,879
- Issue date Feb 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jun Hee Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND M...
- Publication number 20180279478
- Publication date Sep 27, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180068952
- Publication date Mar 8, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Moon Hee YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170309571
- Publication date Oct 26, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Moon Hee YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR CAMERA MODULE AND CAMERA MODULE HAVING THE SAME
- Publication number 20170294469
- Publication date Oct 12, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20160374198
- Publication date Dec 22, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Heung-Kyu KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160302299
- Publication date Oct 13, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Young-Kwan LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160205773
- Publication date Jul 14, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20160105956
- Publication date Apr 14, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jun Oh HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160029488
- Publication date Jan 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160021755
- Publication date Jan 21, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jung Han LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150195907
- Publication date Jul 9, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yul Kyo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THERE...
- Publication number 20140321084
- Publication date Oct 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDING PASSIVE ELEMENT
- Publication number 20140185258
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED SUBSTRATE
- Publication number 20140182889
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yee Na SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140182897
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140182895
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140182916
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yee Na SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND M...
- Publication number 20140182911
- Publication date Jul 3, 2014
- SAMSUNG ELECTRO-MECHANCIS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD O...
- Publication number 20140182896
- Publication date Jul 3, 2014
- SAMSUNG, ELECTRO-MECHANICS CO., LTD.
- Doo Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE...
- Publication number 20140177192
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...
- Publication number 20140151104
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yul Kyo CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...
- Publication number 20140144676
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yul Kyo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED SUBSTRATE
- Publication number 20140131084
- Publication date May 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20140123486
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND PRINTED CIRCUIT BOARD INCLUDING TH...
- Publication number 20140116761
- Publication date May 1, 2014
- Samsung Electronics Co., Ltd.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE EMBEDDED IN SUBSTRATE AND SUBSTRATE WITH PASSIVE DEV...
- Publication number 20140090881
- Publication date Apr 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yee Na SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140080266
- Publication date Mar 20, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130320516
- Publication date Dec 5, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING ME...
- Publication number 20130139382
- Publication date Jun 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Sang-Chul LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130119553
- Publication date May 16, 2013
- Samsung Electro-Mechanics CO., LTD.
- Tae Sung JEONG
- H01 - BASIC ELECTRIC ELEMENTS

Yul Kyo Chung

Person

Patents Grantslast 30 patents

Method for manufacturing a printed circuit board including an embed...

Substrate for camera module and camera module having the same

Fan-out semiconductor package

Printed circuit board including embedded electronic component and m...

Fan-out semiconductor package

Circuit board and method of manufacturing the same

Circuit board and method of manufacturing the same

Printed circuit board including electronic component embedded there...

Multilayered substrate

Electronic component embedded substrate and manufacturing method th...

Substrate embedding passive element

Multilayer ceramic capacitor and printed circuit board including th...

Substrate having electronic component embedded therein and method o...

Multilayered substrate and method of manufacturing the same

Passive device embedded in substrate and substrate with passive dev...

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Embedded printed circuit board and manufacturing method thereof

Method of processing cavity of core substrate

Electronics component embedded PCB

Circuit board and method for testing component built in the circuit...

PCB strip and manufacturing method for electronic component embedde...

Test method for passive device embedded printed circuit board

Capacitor and manufacturing method thereof

Semiconductor chip package and printed circuit board

Method for manufacturing a printed circuit board with a thin film c...

Method for manufacturing a printed circuit board with a thin film c...

Thin film capacitor, thin film capacitor-embedded printed circuit b...

Coating solution for forming high dielectric constant thin film and...

Coating solution for forming high dielectric constant thin film and...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND M...

FAN-OUT SEMICONDUCTOR PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE

SUBSTRATE FOR CAMERA MODULE AND CAMERA MODULE HAVING THE SAME

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THERE...

SUBSTRATE EMBEDDING PASSIVE ELEMENT

MULTILAYERED SUBSTRATE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND M...

SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD O...

CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE...

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...

CAPACITOR EMBEDDED SUBSTRATE

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

MULTILAYER CERAMIC CAPACITOR AND PRINTED CIRCUIT BOARD INCLUDING TH...

PASSIVE DEVICE EMBEDDED IN SUBSTRATE AND SUBSTRATE WITH PASSIVE DEV...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD HAVING ELECTRO COMPONENT AND MANUFACTURING ME...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME