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Wuxi, CN
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Patent Application
SENSING CHIP PACKAGING STRUCTURE AND METHOD
Publication number
20240186200
Publication date
Jun 6, 2024
NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
Peng SUN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FAN-OUT ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR CHIP
Publication number
20220115356
Publication date
Apr 14, 2022
National Center for Advanced Packaging Co., Ltd.
Peng SUN
H01 - BASIC ELECTRIC ELEMENTS