Yuma TAKEUCHI

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,186,742
- Issue date Nov 30, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,149,164
- Issue date Oct 19, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing resin composition, electronic component device, and method...
- Patent number 11,111,407
- Issue date Sep 7, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Yuma Takeuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...
- Publication number 20210363380
- Publication date Nov 25, 2021
- Yuma TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD...
- Publication number 20190233672
- Publication date Aug 1, 2019
- Hitachi Chemical Company, Ltd.
- Yuma TAKEUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT DEVICE
- Publication number 20190144660
- Publication date May 16, 2019
- Hitachi Chemical Company, Ltd.
- Yuma TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...