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Yumi Maruyama
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Kariya-city, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
9,029,960
Issue date
May 12, 2015
Denso Corporation
Yumi Maruyama
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Dicing method for semiconductor substrate
Patent number
7,901,967
Issue date
Mar 8, 2011
Denso Corporation
Atsushi Komura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding method of semiconductor substrate and sheet, and manufactur...
Patent number
7,838,396
Issue date
Nov 23, 2010
Denso Corporation
Yumi Maruyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
VARIABLE FOCUS MIRROR AND OPTICAL SCANNING DEVICE
Publication number
20190064509
Publication date
Feb 28, 2019
Denso Corporation
Koichi OYAMA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20130256813
Publication date
Oct 3, 2013
DENSO CORPORATION
Yumi MARUYAMA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Cap attachment structure, semiconductor sensor device and method
Publication number
20070232107
Publication date
Oct 4, 2007
DENSO CORPORATION
Kazuhiko Sugiura
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor device and dicing method for semiconductor substrate
Publication number
20070111478
Publication date
May 17, 2007
DENSO CORPORATION
Atsushi Komura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wafer product and processing method therefor
Publication number
20070111480
Publication date
May 17, 2007
DENSO CORPORATION
Yumi Maruyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Bonding method of semiconductor substrate and sheet, and manufactur...
Publication number
20070111483
Publication date
May 17, 2007
DENSO CORPORATION
Yumi Maruyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor wafer
Publication number
20070111477
Publication date
May 17, 2007
DENSO CORPORATION
Yumi Maruyama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR