Yumiko Ohshima

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Yokohama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 7,521,787
- Issue date Apr 21, 2009
- Kabushiki Kaisha Toshiba
- Yumiko Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method of semiconductor device
- Patent number 6,486,001
- Issue date Nov 26, 2002
- Kabushiki Kaisha Toshiba
- Yumiko Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package
- Patent number 6,379,484
- Issue date Apr 30, 2002
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a semiconductor package
- Patent number 6,191,024
- Issue date Feb 20, 2001
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor package
- Patent number 6,011,312
- Issue date Jan 4, 2000
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a semiconductor package
- Patent number 5,935,375
- Issue date Aug 10, 1999
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 5,677,246
- Issue date Oct 14, 1997
- Kabushiki Kaisha Toshiba
- Hideaki Maeta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device
- Publication number 20060255472
- Publication date Nov 16, 2006
- Kabushiki Kaisha Toshiba
- Yumiko Ohshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for manufacturing a semiconductor package
- Publication number 20010000754
- Publication date May 3, 2001
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS