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Yun-Biao Xin
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Glastonbury, CT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method and apparatus for processing a semiconductor wafer using nov...
Patent number
6,709,981
Issue date
Mar 23, 2004
MEMC Electronic Materials, Inc.
Alexis Grabbe
B24 - GRINDING POLISHING
Information
Patent Grant
Method of estimating post-polishing waviness characteristics of a s...
Patent number
6,613,591
Issue date
Sep 2, 2003
MEMC Electronic Materials, Inc.
Milind S. Bhagavat
B24 - GRINDING POLISHING
Information
Patent Grant
Process for reducing surface variations for polished wafer
Patent number
6,479,386
Issue date
Nov 12, 2002
MEMC Electronic Materials, Inc.
Kan-Yin Ng
B24 - GRINDING POLISHING
Information
Patent Grant
Method and apparatus for a wafer carrier having an insert
Patent number
6,454,635
Issue date
Sep 24, 2002
MEMC Electronic Materials, Inc.
Guoqiang David Zhang
B24 - GRINDING POLISHING
Information
Patent Grant
Method for processing a semiconductor wafer
Patent number
6,227,944
Issue date
May 8, 2001
MEMC Electronics Materials, Inc.
Yun-Biao Xin
B24 - GRINDING POLISHING
Information
Patent Grant
Method of processing semiconductor wafers to build in back surface...
Patent number
6,214,704
Issue date
Apr 10, 2001
MEMC Electronic Materials, Inc.
Yun-Biao Xin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for reducing waviness in semiconductor wafers
Patent number
6,200,908
Issue date
Mar 13, 2001
MEMC Electronic Materials, Inc.
Roland Vandamme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of processing semiconductor wafers
Patent number
6,114,245
Issue date
Sep 5, 2000
MEMC Electronic Materials, Inc.
Roland Vandamme
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF ESTIMATING POST-POLISHING WAVINESS CHARACTERISTICS OF A S...
Publication number
20030170920
Publication date
Sep 11, 2003
MEMC Electronic Materials, Inc.
Milind S. Bhagavat
B24 - GRINDING POLISHING
Information
Patent Application
Method and apparatus for processing a semiconductor wafer using nov...
Publication number
20020052064
Publication date
May 2, 2002
Alexis Grabbe
B24 - GRINDING POLISHING