Yun-Chen Hsieh

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device enhancing stability and touch sensing effects
- Patent number 12,079,418
- Issue date Sep 3, 2024
- E Ink Holdings Inc.
- Te-Lung Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 12,020,983
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 11,776,847
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process including a re-etching process for forming a semiconductor...
- Patent number 11,742,317
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 11,651,994
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDLS and structure formed thereof
- Patent number 11,600,574
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,587,902
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and fabrication method of the same
- Patent number 11,555,951
- Issue date Jan 17, 2023
- E Ink Holdings Inc.
- Chih-Cheng Ko
- G02 - OPTICS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 11,527,466
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,404,308
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming features of semiconductor structure having reduc...
- Patent number 11,139,174
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xi-Zong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 11,088,025
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover plate structure and display apparatus
- Patent number 11,042,070
- Issue date Jun 22, 2021
- E Ink Holdings Inc.
- Yun-Nan Hsieh
- G02 - OPTICS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 10,971,442
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 10,964,591
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing conductive feature and method of manufactur...
- Patent number 10,892,228
- Issue date Jan 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDLS and structure formed thereof
- Patent number 10,886,231
- Issue date Jan 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,874
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 10,840,129
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 10,679,896
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 10,522,501
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming features of semiconductor structure having reduc...
- Patent number 10,515,817
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xi-Zong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 10,515,848
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 10,361,122
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing redistribution circuit structure and method...
- Patent number 10,297,551
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,186,462
- Issue date Jan 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 10,083,863
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front light module and electronic paper display device having the same
- Patent number 9,612,475
- Issue date Apr 4, 2017
- E Ink Holdings Inc.
- Yun-Nan Hsieh
- G02 - OPTICS
Information Patent Grant
Touch sensor applied on large size display
- Patent number 9,513,728
- Issue date Dec 6, 2016
- E Ink Holdings Inc.
- Yun-Nan Hsieh
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND CHIP
- Publication number 20240321828
- Publication date Sep 26, 2024
- ALi Corporation
- Liang-Cai Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT LIGHT MODULE AND ELECTROPHORETIC DISPLAY DEVICE
- Publication number 20240280875
- Publication date Aug 22, 2024
- E Ink Holdings Inc.
- Chih Cheng Ko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE ENHANCING STABILITY AND TOUCH SENSING EFFECTS
- Publication number 20240256076
- Publication date Aug 1, 2024
- E Ink Holdings Inc.
- Te-Lung Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240021474
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Lid.
- Yun-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION TOOL AND INSPECTION METHOD FOR AN TOUCH PLATE
- Publication number 20230297184
- Publication date Sep 21, 2023
- E Ink Holdings Inc.
- Chien-Hsing Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Processes for Reducing Leakage and Improving Adhesion
- Publication number 20230274976
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming RDLS and Structure Formed Thereof
- Publication number 20230207478
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Via Sidewall Adhesion with Encapsulant
- Publication number 20230115729
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20210366770
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT LIGHT MODULE AND DISPLAY DEVICE HAVING THE SAME
- Publication number 20210278877
- Publication date Sep 9, 2021
- E Ink Holdings Inc.
- Yun-Nan HSIEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Processes for Reducing Leakage and Improving Adhesion
- Publication number 20210242083
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Via Sidewall Adhesion with Encapsulant
- Publication number 20210225751
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming RDLS and Structure Formed Thereof
- Publication number 20210098383
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20210082745
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND FABRICATION METHOD OF THE SAME
- Publication number 20200400866
- Publication date Dec 24, 2020
- E Ink Holdings Inc.
- Chih-Cheng KO
- G02 - OPTICS
Information Patent Application
COVER PLATE STRUCTURE AND DISPLAY APPARATUS
- Publication number 20200387042
- Publication date Dec 10, 2020
- E Ink Holdings Inc.
- Yun-Nan HSIEH
- G02 - OPTICS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20200286781
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20200126850
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Features of Semiconductor Structure Having Reduc...
- Publication number 20200118825
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xi-Zong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming the Same
- Publication number 20200051949
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming the Same
- Publication number 20200013750
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming RDLS and Structure Formed Thereof
- Publication number 20200006240
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes for Reducing Leakage and Improving Adhesion
- Publication number 20190326167
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Via Sidewall Adhesion With Encapsulant
- Publication number 20190318986
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING CONDUCTIVE FEATURE AND METHOD OF MANUFACTU...
- Publication number 20190273045
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20190214317
- Publication date Jul 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-step Etching to Form RDL
- Publication number 20190157240
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING FEATURES OF SEMICONDUCTOR STRUCTURE HAVING REDUC...
- Publication number 20190103281
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xi-Zong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure for Semiconductor Device
- Publication number 20190088542
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Yun-Chen Hsieh

Person

Patents Grantslast 30 patents

Electronic device enhancing stability and touch sensing effects

Semiconductor device having via sidewall adhesion with encapsulant

Processes for reducing leakage and improving adhesion

Contact structure for semiconductor device

Process including a re-etching process for forming a semiconductor...

Processes for reducing leakage and improving adhesion

Method of forming RDLS and structure formed thereof

Semiconductor structure and method of forming the same

Display device and fabrication method of the same

Semiconductor device having via sidewall adhesion with encapsulant

Semiconductor package and method

Method for forming features of semiconductor structure having reduc...

Contact structure for semiconductor device

Cover plate structure and display apparatus

Semiconductor device having via sidewall adhesion with encapsulant

Processes for reducing leakage and improving adhesion

Method of manufacturing conductive feature and method of manufactur...

Method of forming RDLS and structure formed thereof

Semiconductor device and method

Semiconductor package and method

Contact structure for semiconductor device

Semiconductor structure and method of forming the same

Method for forming features of semiconductor structure having reduc...

Semiconductor package and method

Processes for reducing leakage and improving adhesion

Method of manufacturing redistribution circuit structure and method...

Semiconductor device and method

Contact structure for semiconductor device

Front light module and electronic paper display device having the same

Touch sensor applied on large size display

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURE AND CHIP

FRONT LIGHT MODULE AND ELECTROPHORETIC DISPLAY DEVICE

ELECTRONIC DEVICE ENHANCING STABILITY AND TOUCH SENSING EFFECTS

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

Process Including a Re-etching Process for Forming a Semiconductor...

INSPECTION TOOL AND INSPECTION METHOD FOR AN TOUCH PLATE

Processes for Reducing Leakage and Improving Adhesion

Method of Forming RDLS and Structure Formed Thereof

Semiconductor Device Having Via Sidewall Adhesion with Encapsulant

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

FRONT LIGHT MODULE AND DISPLAY DEVICE HAVING THE SAME

Processes for Reducing Leakage and Improving Adhesion

Semiconductor Device Having Via Sidewall Adhesion with Encapsulant

Method of Forming RDLS and Structure Formed Thereof

Semiconductor Package and Method

DISPLAY DEVICE AND FABRICATION METHOD OF THE SAME

COVER PLATE STRUCTURE AND DISPLAY APPARATUS

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

Semiconductor Package and Method

Method for Forming Features of Semiconductor Structure Having Reduc...

Semiconductor Structure and Method of Forming the Same

Semiconductor Structure and Method of Forming the Same

Method of Forming RDLS and Structure Formed Thereof

Processes for Reducing Leakage and Improving Adhesion

Semiconductor Device Having Via Sidewall Adhesion With Encapsulant

METHODS OF MANUFACTURING CONDUCTIVE FEATURE AND METHOD OF MANUFACTU...

Semiconductor Device and Method

Three-step Etching to Form RDL

METHOD FOR FORMING FEATURES OF SEMICONDUCTOR STRUCTURE HAVING REDUC...

Contact Structure for Semiconductor Device