Yun-Chou Yeh

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bio-mimicked three-dimensional laminated structure
- Patent number 11,457,694
- Issue date Oct 4, 2022
- National Taiwan University of Science and Technology
- Ajeet Kumar
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat dissipation structure with heat pipes arranged in two spaced a...
- Patent number 9,593,887
- Issue date Mar 14, 2017
- Tai-Sol Electronics Co., Ltd.
- Yun-Yeu Yeh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fastening structure for expansion card
- Patent number 7,672,144
- Issue date Mar 2, 2010
- Inventec Corporation
- Yun-Chieh Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Foldable water container
- Patent number 5,088,838
- Issue date Feb 18, 1992
- Yun-Hui Yeh
- A45 - HAND OR TRAVELLING ARTICLES

Patents Applicationslast 30 patents

Information Patent Application
BIO-MIMICKED THREE-DIMENSIONAL LAMINATED STRUCTURE
- Publication number 20210186152
- Publication date Jun 24, 2021
- National Taiwan University of Science and Technology
- Ajeet Kumar
- A43 - FOOTWEAR
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20170363367
- Publication date Dec 21, 2017
- TAI-SOL ELECTRONICS CO., LTD.
- Yun-Yeu YEH
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SPREADER WITH A LIQUID-VAPOR SEPARATION STRUCTURE
- Publication number 20170350657
- Publication date Dec 7, 2017
- TAI-SOL ELECTRONICS CO., LTD.
- Yun-Yeu YEH
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FIXTURE DEVICE FOR HEAT-DISSIPATING MODULE AND HEAT-DISSIPATING MOD...
- Publication number 20170034952
- Publication date Feb 2, 2017
- TAI-SOL ELECTRONICS CO., LTD.
- Yun-Yeu YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced a...
- Publication number 20160298909
- Publication date Oct 13, 2016
- TAI-SOL ELECTRONICS CO., LTD.
- Yun-Yeu YEH
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SPREADER-BASED HEAT SINK MODULE
- Publication number 20160262289
- Publication date Sep 8, 2016
- TAI-SOL ELECTRONICS CO., LTD.
- Yun-Yeu YEH
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMOELECTRIC-COOLING-CHIP-BASED HEAT-DISSPATING SYSTEM
- Publication number 20160219755
- Publication date Jul 28, 2016
- TAI-SOL ELECTRONICS CO., LTD.
- Yaw-Huey LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING STRUCTURE
- Publication number 20160209121
- Publication date Jul 21, 2016
- TAI-SOL ELECTRONICS CO., LTD.
- Yun-Yeu YEH
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Multilayer Printed Circuit Board Structure
- Publication number 20140262450
- Publication date Sep 18, 2014
- Yun-Chao YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FASTENING STRUCTURE FOR EXPANSION CARD
- Publication number 20100014266
- Publication date Jan 21, 2010
- Inventec Corporation
- Yun-Chieh Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wheel for a vehicle
- Publication number 20080018169
- Publication date Jan 24, 2008
- Yun-Chou Yeh
- B60 - VEHICLES IN GENERAL
Information Patent Application
Fastening device for heat sink
- Publication number 20060232938
- Publication date Oct 19, 2006
- Inventec Corporation
- Yun-Chieh Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Yun-Chou Yeh

Person

Patents Grantslast 30 patents

Bio-mimicked three-dimensional laminated structure

Heat dissipation structure with heat pipes arranged in two spaced a...

Fastening structure for expansion card

Foldable water container

Patents Applicationslast 30 patents

BIO-MIMICKED THREE-DIMENSIONAL LAMINATED STRUCTURE

HEAT DISSIPATION DEVICE

HEAT SPREADER WITH A LIQUID-VAPOR SEPARATION STRUCTURE

FIXTURE DEVICE FOR HEAT-DISSIPATING MODULE AND HEAT-DISSIPATING MOD...

Heat Dissipation Structure with Heat Pipes Arranged in Two Spaced a...

HEAT SPREADER-BASED HEAT SINK MODULE

THERMOELECTRIC-COOLING-CHIP-BASED HEAT-DISSPATING SYSTEM

HEAT-DISSIPATING STRUCTURE

Multilayer Printed Circuit Board Structure

FASTENING STRUCTURE FOR EXPANSION CARD

Wheel for a vehicle

Fastening device for heat sink