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Taoyuan City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Advanced reverse treated electrodeposited copper foil and copper cl...
Patent number
11,655,555
Issue date
May 23, 2023
CO-TECH DEVELOPMENT CORP.
Yun-Hsing Sung
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Advanced electrodeposited copper foil having island-shaped microstr...
Patent number
11,408,087
Issue date
Aug 9, 2022
CO-TECH DEVELOPMENT CORP.
Yun-Hsing Sung
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Advanced electrodeposited copper foil and copper clad laminate usin...
Patent number
11,332,839
Issue date
May 17, 2022
CO-TECH DEVELOPMENT CORP.
Yun-Hsing Sung
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Micro-roughened electrodeposited copper foil and copper clad lamina...
Patent number
11,186,918
Issue date
Nov 30, 2021
CO-TECH DEVELOPMENT CORP.
Yun-Hsing Sung
B32 - LAYERED PRODUCTS
Information
Patent Grant
Micro-roughened electrodeposited copper foil and copper foil substrate
Patent number
11,053,602
Issue date
Jul 6, 2021
CO-TECH DEVELOPMENT CORP.
Yun-Hsing Sung
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Micro-roughened electrodeposited copper foil and copper foil substrate
Patent number
11,047,061
Issue date
Jun 29, 2021
CO-TECH DEVELOPMENT CORP.
Yun-Hsing Sung
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
Publication number
20210321514
Publication date
Oct 14, 2021
CO-TECH DEVELOPMENT CORP.
Yun-Hsing SUNG
B32 - LAYERED PRODUCTS
Information
Patent Application
ADVANCED REVERSE-TREATED ELECTRODEPOSITED COPPER FOIL AND COPPER CL...
Publication number
20200399775
Publication date
Dec 24, 2020
CO-TECH DEVELOPMENT CORP.
YUN-HSING SUNG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ADVANCED TREATED ELECTRODEPOSITED COPPER FOIL HAVING LONG AND ISLAN...
Publication number
20200399776
Publication date
Dec 24, 2020
CO-TECH DEVELOPMENT CORP.
YUN-HSING SUNG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
Publication number
20200404784
Publication date
Dec 24, 2020
CO-TECH DEVELOPMENT CORP.
Yun-Hsing SUNG
B32 - LAYERED PRODUCTS
Information
Patent Application
ADVANCED REVERSE TREATED ELECTRODEPOSITED COPPER FOIL AND COPPER CL...
Publication number
20200392640
Publication date
Dec 17, 2020
CO-TECH DEVELOPMENT CORP.
YUN-HSING SUNG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINA...
Publication number
20200141017
Publication date
May 7, 2020
CO-TECH DEVELOPMENT CORP.
YUN-HSING SUNG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER FOIL SUBSTRATE
Publication number
20200095701
Publication date
Mar 26, 2020
CO-TECH DEVELOPMENT CORP.
YUN-HSING SUNG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER FOIL SUBSTRATE
Publication number
20200087811
Publication date
Mar 19, 2020
CO-TECH DEVELOPMENT CORP.
YUN-HSING SUNG
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR