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Yun-Je JI

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  • Suwon-si, KR
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240172368
    • Publication date May 23, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Yun Je JI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230171900
    • Publication date Jun 1, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Woong CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
    • Publication number 20230108748
    • Publication date Apr 6, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Yun Je JI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20220361324
    • Publication date Nov 10, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Yun Je JI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE
    • Publication number 20220087025
    • Publication date Mar 17, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Yun Je JI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE STRUCTURE
    • Publication number 20220005765
    • Publication date Jan 6, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Moon Hee Yi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE
    • Publication number 20210212201
    • Publication date Jul 8, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Jun Oh Hwang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE SUBSTRATE AND MULTI-CHIP PACKAGE INCLUDING THE SAME
    • Publication number 20210175176
    • Publication date Jun 10, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Yun Je Ji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPONENT MOUNTED BOARD AND ELECTRONIC DEVICE COMPRISING THE SAME
    • Publication number 20210136916
    • Publication date May 6, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Seong Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20200305282
    • Publication date Sep 24, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae-Ho SHIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR