Yun Seok Song

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Gwangju, KR

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding interconnection using laser and thermal compression
- Patent number 11,749,637
- Issue date Sep 5, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Min Ho Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BONDING INTERCONNECTION USING LASER AND THERMAL COMPRESSION
- Publication number 20210398940
- Publication date Dec 23, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Min Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDED DEVICES, LASER BONDING TOOLS, AND RELATED METHODS
- Publication number 20210398936
- Publication date Dec 23, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR