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Yun-Tai SHIH
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Lugang Township, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Wafer bonding method and wafer bonding apparatus
Patent number
11,721,662
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yun-Tai Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding alignment tool
Patent number
10,847,490
Issue date
Nov 24, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Yun-Tai Shih
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Bonding alignment tool
Patent number
10,396,054
Issue date
Aug 27, 2019
Taiwan Semiconductor Manufacturing Company, Ltd
Yun-Tai Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding alignment tool and method
Patent number
9,123,754
Issue date
Sep 1, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Tai Shih
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
WAFER BONDING METHOD AND WAFER BONDING APPARATUS
Publication number
20210050324
Publication date
Feb 18, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Tai SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING ALIGNMENT TOOL
Publication number
20190378813
Publication date
Dec 12, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Tai SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING ALIGNMENT TOOL
Publication number
20150340337
Publication date
Nov 26, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Tai SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING ALIGNMENT TOOL AND METHOD
Publication number
20130086786
Publication date
Apr 11, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Yun-Tai SHIH
H01 - BASIC ELECTRIC ELEMENTS